Inventor · disambiguated record
Wai Yuen Cheung
Also filed as: CHEUNG WAI YUEN
4 granted patents·9 citations·filing 2004–2016
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0158US10882298B2System for adjusting relative positions between components of a bonding apparatusASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jan 5, 2021·1 cites·15 claims
- 0255US6991967B2Apparatus and method for die attachmentASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Jan 31, 2006·8 cites·16 claims
- 0335US8590143B2Apparatus for delivering semiconductor components to a substrateLAM KUI KAM·Filed 2011·Granted Nov 26, 2013·0 cites·8 claims
- 0431US8293043B2Automatic level adjustment for die bonderCHUNG KWOK KEE·Filed 2006·Granted Oct 23, 2012·0 cites·14 claims
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