Inventor · disambiguated record
Tetsuo Saji
Also filed as: SAJI TETSUO
35 granted patents·4 pending applications·237 citations·filing 1989–2017
97Inventor score
Top patents by PatentIndex Score
39 records- 0196US8483104B1High-frequency circuit moduleSAJI TETSUO·Filed 2012·Granted Jul 9, 2013·25 cites·13 claims
- 0295US8849362B1Communication moduleTAIYO YUDEN KK·Filed 2014·Granted Sep 30, 2014·26 cites·15 claims
- 0393US8897019B1Circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Nov 25, 2014·22 cites·3 claims
- 0492US10187109B2Filter circuit, front end circuit, and moduleTAIYO YUDEN KK·Filed 2017·Granted Jan 22, 2019·8 cites·14 claims
- 0592US8706056B2High-frequency circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Apr 22, 2014·9 cites·26 claims
- 0691US5203974AProcess for producing thin filmsIDEMITSU KOSAN CO·Filed 1992·Granted Apr 20, 1993·45 cites·18 claims
- 0787US8890309B1Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Nov 18, 2014·8 cites·3 claims
- 0884US9456488B2Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Sep 27, 2016·7 cites·5 claims
- 0983US9866265B2High frequency circuit module in which high frequency circuits are embedded in a multilayer circuit substrateTAIYO YUDEN KK·Filed 2013·Granted Jan 9, 2018·6 cites·12 claims
- 1083US9590288B2Multilayer circuit substrateTAIYO YUDEN KK·Filed 2015·Granted Mar 7, 2017·4 cites·8 claims
- 1182US9101050B2Circuit module having electrical shieldTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·6 cites·1 claims
- 1282US9101044B2Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·6 cites·11 claims
- 1380US9451690B2High frequency circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Sep 20, 2016·5 cites·7 claims
- 1480US8536959B1Substrate with built-in electronic componentMUGIYA EIJI·Filed 2012·Granted Sep 17, 2013·7 cites·8 claims
- 1578US5122247AProcess for producing thin filmsIDEMITSU KOSAN CO·Filed 1989·Granted Jun 16, 1992·20 cites·21 claims
- 1676US5082539AFerrocene compounds and uses thereofIDEMITSU KOSAN CO·Filed 1990·Granted Jan 21, 1992·14 cites·62 claims
- 1774US8735732B2Multilayer substrateSAJI TETSUO·Filed 2011·Granted May 27, 2014·3 cites·22 claims
- 1873US9705557B2Front end circuit, module, and communication deviceTAIYO YUDEN KK·Filed 2016·Granted Jul 11, 2017·2 cites·12 claims
- 1973US9282632B2Multilayer circuit substrateTAIYO YUDEN KK·Filed 2013·Granted Mar 8, 2016·2 cites·10 claims
- 2071US6635166B2Composite plating methodJAPAN SCIENCE & TECH CORP·Filed 2001·Granted Oct 21, 2003·10 cites·4 claims
- 2161US9065539B2Circuit moduleTAIYO YUDEN KK·Filed 2014·Granted Jun 23, 2015·1 cites·8 claims
- 2260US9007782B1Substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2014·Granted Apr 14, 2015·0 cites·20 claims
- 2359US9894816B2Circuit moduleTAIYO YUDEN KK·Filed 2015·Granted Feb 13, 2018·1 cites·4 claims
- 2458US2014349596A1High-frequency circuit moduleTAIYO YUDEN KK·Filed 2014·Application pending·0 cites
- 2557US8923009B2Substrate with built-in electronic componentTAIYO YUDEN KK·Filed 2013·Granted Dec 30, 2014·0 cites·10 claims
- 2657US8731486B2High-frequency circuit moduleTAIYO YUDEN KK·Filed 2013·Granted May 20, 2014·0 cites·4 claims
- 2757US8725086B2High-frequency circuit moduleTAIYO YUDEN KK·Filed 2013·Granted May 13, 2014·0 cites·26 claims
- 2856US8838059B2High-frequency circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Sep 16, 2014·0 cites·6 claims
- 2956US8725087B2High-frequency circuit moduleTAIYO YUDEN KK·Filed 2013·Granted May 13, 2014·0 cites·29 claims
- 3054US9018039B2Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2014·Granted Apr 28, 2015·0 cites·2 claims
- 3153US9107305B2Multilayer substrateTAIYO YUDEN KK·Filed 2013·Granted Aug 11, 2015·0 cites·13 claims
- 3252US9526165B2Multilayer circuit substrateTAIYO YUDEN KK·Filed 2013·Granted Dec 20, 2016·0 cites·16 claims
- 3351US8912802B2Component-embedded circuit substrate and method of inspecting the sameTAIYO YUDEN KK·Filed 2014·Granted Dec 16, 2014·0 cites·20 claims
- 3450US9985681B2Front end circuit, module, and communication deviceTAIYO YUDEN KK·Filed 2017·Granted May 29, 2018·0 cites·15 claims
- 3546US9160825B2Communication moduleTAIYO YUDEN KK·Filed 2014·Granted Oct 13, 2015·0 cites·8 claims
- 3645US2018202976A1Sensor circuit and sensing methodTAIYO YUDEN KK·Filed 2017·Application pending·0 cites
- 3743US2015062835A1Circuit moduleTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 3843US2015043172A1Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 3940US9041485B2High frequency electronic componentSAJI TETSUO·Filed 2012·Granted May 26, 2015·0 cites·12 claims
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