Inventor · disambiguated record
Sophie Verrun
Also filed as: VERRUN SOPHIE
3 granted patents·23 citations·filing 2008–2009
65Inventor score
Top patents by PatentIndex Score
3 records- 0190US8723312B2Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire elementBRUN JEAN·Filed 2008·Granted May 13, 2014·20 cites·24 claims
- 0258US8039306B23D integration of vertical components in reconstituted substratesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Oct 18, 2011·2 cites·26 claims
- 0356US8611101B2Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assemblyBRUN JEAN·Filed 2009·Granted Dec 17, 2013·1 cites·18 claims
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