Inventor · disambiguated record
Jing Li Yuan
Also filed as: YUAN JING LI
2 granted patents·2 pending applications·13 citations·filing 2008–2010
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0183US8704350B2Stacked wafer level package and method of manufacturing the samePARK SEUNG WOOK·Filed 2009·Granted Apr 22, 2014·11 cites·5 claims
- 0260US7670878B2Method for manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 2, 2010·2 cites·10 claims
- 0347US2009085134A1Wafer-level image sensor module, method of manufacturing the same, and camera moduleSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0443US2011012220A1Wafer-level image sensor module, method of manufacturing the same and camera moduleSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →