Inventor · disambiguated record
Hidemi Matsukuma
Also filed as: MATSUKUMA HIDEMI
3 granted patents·14 citations·filing 1994–2003
63Inventor score
Top patents by PatentIndex Score
3 records- 0159US6575348B2Wire bonding apparatus with spurious vibration suppressing structureNEC ELECTRONICS CORP·Filed 2002·Granted Jun 10, 2003·9 cites·4 claims
- 0237US6779702B2Wire bonding apparatus with spurious vibration suppressing structureNEC ELECTRONICS CORP·Filed 2003·Granted Aug 24, 2004·0 cites·3 claims
- 0332US5535789ALead wire forming apparatus capable of preventing the peeling of the solder from the lead wireNEC CORP·Filed 1994·Granted Jul 16, 1996·5 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →