Inventor · disambiguated record
Tetsuya Hayashida
Also filed as: HAYASHIDA TETSUYA
32 granted patents·2 pending applications·1,532 citations·filing 1979–2013
98Inventor score
Top patents by PatentIndex Score
34 records- 0198US6208525B1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 1998·Granted Mar 27, 2001·270 cites·12 claims
- 0295US6471115B1Process for manufacturing electronic circuit devicesHITACHI LTD·Filed 2000·Granted Oct 29, 2002·91 cites·4 claims
- 0392US6780677B2Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2002·Granted Aug 24, 2004·43 cites·7 claims
- 0492US5219794ASemiconductor integrated circuit device and method of fabricating sameHITACHI LTD·Filed 1992·Granted Jun 15, 1993·149 cites·16 claims
- 0590US4243506APlasma-etching apparatusHITACHI LTD·Filed 1979·Granted Jan 6, 1981·35 cites·10 claims
- 0689US6227436B1Method of fabricating an electronic circuit device and apparatus for performing the methodHITACHI LTD·Filed 1998·Granted May 8, 2001·68 cites·20 claims
- 0789US5865365AMethod of fabricating an electronic circuit deviceHITACHI LTD·Filed 1996·Granted Feb 2, 1999·132 cites·37 claims
- 0889US5217922AMethod for forming a silicide layer and barrier layer on a semiconductor device rear surfaceHITACHI LTD·Filed 1991·Granted Jun 8, 1993·108 cites·16 claims
- 0987US6461896B1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 8, 2002·27 cites·9 claims
- 1087US4805147AStacked static random access memory cell having capacitorHITACHI LTD·Filed 1986·Granted Feb 14, 1989·54 cites·20 claims
- 1186US6380621B1Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2000·Granted Apr 30, 2002·39 cites·9 claims
- 1282US6767767B2Method of manufacturing a semiconductor device in which a block molding package utilizes air vents in a substrateRENESAS TECH CORP·Filed 2002·Granted Jul 27, 2004·29 cites·23 claims
- 1382US6111322ASemiconductor device and manufacturing method thereofHITACHI LTD·Filed 1997·Granted Aug 29, 2000·59 cites·4 claims
- 1480US5276586ABonding structure of thermal conductive members for a multi-chip moduleHITACHI LTD·Filed 1992·Granted Jan 4, 1994·69 cites·11 claims
- 1579US4575399AMethod of pattern detectionHITACHI LTD·Filed 1985·Granted Mar 11, 1986·40 cites·10 claims
- 1677US5878943AMethod of fabricating an electronic circuit device and apparatus for performing the methodHITACHI LTD·Filed 1996·Granted Mar 9, 1999·51 cites·27 claims
- 1777US4563241AMethod of forming patternsHITACHI LTD·Filed 1984·Granted Jan 7, 1986·26 cites·20 claims
- 1876US6737741B2Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2002·Granted May 18, 2004·13 cites·2 claims
- 1976US5849606ASemiconductor device and manufacturing of the sameHITACHI LTD·Filed 1996·Granted Dec 15, 1998·53 cites·8 claims
- 2071US6787442B2Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metalRENESAS TECH CORP·Filed 2003·Granted Sep 7, 2004·14 cites·4 claims
- 2170US5341980AMethod of fabricating electronic circuit device and apparatus for performing the same methodHITACHI LTD·Filed 1992·Granted Aug 30, 1994·35 cites·34 claims
- 2268US6781234B2Semiconductor device having electrodes containing at least copper nickel phosphorous and tinRENESAS TECH CORP·Filed 2002·Granted Aug 24, 2004·13 cites·16 claims
- 2363US8820547B2Movable rack unitTHK CO LTD·Filed 2013·Granted Sep 2, 2014·3 cites·3 claims
- 2457US5885852APackaged semiconductor device having a flange at its side surface and its manufacturing methodHITACHI LTD·Filed 1997·Granted Mar 23, 1999·25 cites·13 claims
- 2552US5816473AMethod of fabricating electronic circuit device and apparatus for performing the same methodHITACHI LTD·Filed 1995·Granted Oct 6, 1998·15 cites·45 claims
- 2651US4887145ASemiconductor device in which electrodes are formed in a self-aligned mannerHITACHI LTD·Filed 1986·Granted Dec 12, 1989·18 cites·40 claims
- 2751US4812894ASemiconductor deviceHITACHI LTD·Filed 1988·Granted Mar 14, 1989·17 cites·16 claims
- 2850US4956688ARadiation resistant bipolar memoryHITACHI LTD·Filed 1989·Granted Sep 11, 1990·13 cites·37 claims
- 2949US6953709B2Semiconductor device and its manufacturing methodRENESAS NTHN JP SEMICONDUCTOR·Filed 2002·Granted Oct 11, 2005·3 cites·3 claims
- 3041US4858184ARadiation resistant bipolar memoryHITACHI LTD·Filed 1987·Granted Aug 15, 1989·7 cites·12 claims
- 3141US2001002163A1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2001·Application pending·0 cites
- 3241US2001002162A1Process for mounting electronic device and semiconductor deviceHITACHI LTD·Filed 2001·Application pending·0 cites
- 3337US4958320ARadiation resistant bipolar memoryHITACHI LTD·Filed 1989·Granted Sep 18, 1990·5 cites·30 claims
- 3436US4926235ASemiconductor deviceTAMAKI YOICHI·Filed 1987·Granted May 15, 1990·8 cites·30 claims
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