Inventor · disambiguated record
Yuji Hotta
Also filed as: HOTTA YUJI
57 granted patents·27 pending applications·813 citations·filing 1981–2024
99Inventor score
Top patents by PatentIndex Score
84 records- 0198US4409323ASilver halide photographic materialKONISHIROKU PHOTO IND·Filed 1981·Granted Oct 11, 1983·93 cites·9 claims
- 0290US4643917AHeat-sensitive transfer recording mediumKONISHIROKU PHOTO IND·Filed 1984·Granted Feb 17, 1987·37 cites·12 claims
- 0389US6978079B2Optical semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Dec 20, 2005·13 cites·7 claims
- 0487US6492484B2PolycarbodiimideNITTO DENKO CORP·Filed 2001·Granted Dec 10, 2002·25 cites·13 claims
- 0587US6245175B1Anisotropic conductive film and production method thereofNITTO DENKO CORP·Filed 1997·Granted Jun 12, 2001·52 cites·18 claims
- 0686US4572860AThermal transfer recording mediumKONISHIROKU PHOTO IND·Filed 1984·Granted Feb 25, 1986·27 cites·20 claims
- 0785US8797638B2Wavelength selective optical switch device and method of controlling characteristics thereofSANTEC CORP·Filed 2012·Granted Aug 5, 2014·7 cites·20 claims
- 0884US6394821B1Anisotropic conductive film and production method thereofNITTO DENKO CORP·Filed 2000·Granted May 28, 2002·34 cites·6 claims
- 0983US8609235B2Porous ceramic material and method of producing the sameHOTTA YUJI·Filed 2007·Granted Dec 17, 2013·9 cites·14 claims
- 1083US7290902B2Direct-type backlightNITTO DENKO CORP·Filed 2005·Granted Nov 6, 2007·13 cites·13 claims
- 1182US5846477AProduction method for encapsulating a semiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Dec 8, 1998·78 cites·10 claims
- 1279US7559681B2Light pipe for direct-type backlight and direct-type backlightNITTO DENKO CORP·Filed 2005·Granted Jul 14, 2009·9 cites·13 claims
- 1379US6890617B1Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereofNITTO DENKO CORP·Filed 2000·Granted May 10, 2005·16 cites·4 claims
- 1477US6961185B2Microlens arrayNITTO DENKO CORP·Filed 2004·Granted Nov 1, 2005·13 cites·9 claims
- 1577US6144108ASemiconductor device and method of fabricating the sameNITTO DENKO CORP·Filed 1997·Granted Nov 7, 2000·55 cites·11 claims
- 1674US6652688B2Process for producing semiconductor wafer with adhesive filmNITTO DENKO CORP·Filed 2002·Granted Nov 25, 2003·21 cites·10 claims
- 1774US2025188265A1Resin productTOYODA GOSEI KK·Filed 2024·Application pending·0 cites
- 1873US11198944B2Black plated resin part and method for producing the sameTOYODA GOSEI KK·Filed 2019·Granted Dec 14, 2021·0 cites·6 claims
- 1972US8488229B2Method for calibration of optically variable filter array apparatusHOTTA YUJI·Filed 2011·Granted Jul 16, 2013·2 cites·11 claims
- 2072US7722965B2Electroluminescence device, planar light source and display using the sameNITTO DENKO CORP·Filed 2004·Granted May 25, 2010·16 cites·12 claims
- 2172US7221007B2Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheetNITTO DENKO CORP·Filed 2005·Granted May 22, 2007·3 cites·5 claims
- 2272US4623580AThermal transfer recording mediumKONISHIROKU PHOTO IND·Filed 1984·Granted Nov 18, 1986·22 cites·20 claims
- 2371US6669869B2Anisotropic conductive filmNITTO DENKO CORP·Filed 2002·Granted Dec 30, 2003·17 cites·14 claims
- 2470US11761106B2Method for producing black plated resin partTOYODA GOSEI KK·Filed 2021·Granted Sep 19, 2023·0 cites·2 claims
- 2569US8885111B2Optical node deviceSANTEC CORP·Filed 2013·Granted Nov 11, 2014·1 cites·20 claims
- 2668US7267808B2Aluminum nitride powder, method for producing the same and use thereofAIST·Filed 2005·Granted Sep 11, 2007·3 cites·15 claims
- 2766US7189591B2Process for producing light-emitting semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Mar 13, 2007·17 cites·7 claims
- 2866US6613608B1Semiconductor wafer with anisotropic conductor film, and method of manufacture thereofNITTO DENKO CORP·Filed 2000·Granted Sep 2, 2003·13 cites·14 claims
- 2965US6566608B2Production method of anisotropic conductive film and anisotropic conductive film produced by this methodNITTO DENKO CORP·Filed 2001·Granted May 20, 2003·9 cites·5 claims
- 3063US7056406B2Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereofNITTO DENKO CORP·Filed 2003·Granted Jun 6, 2006·2 cites·6 claims
- 3163US5834850AEncapsulated semiconductor device having metal foil covering, and metal foilNITTO DENKO CORP·Filed 1996·Granted Nov 10, 1998·26 cites·13 claims
- 3262US6667542B2Anisotropic conductive film-containing deviceNITTO DENKO CORP·Filed 2001·Granted Dec 23, 2003·10 cites·4 claims
- 3362US6538309B1Semiconductor device and circuit board for mounting semiconductor elementNITTO DENKO CORP·Filed 2000·Granted Mar 25, 2003·11 cites·9 claims
- 3462US5821628ASemiconductor device and two-layer lead frame for itNITTO DENKO CORP·Filed 1997·Granted Oct 13, 1998·26 cites·10 claims
- 3562US2024382558A1Pharmaceutical composition for preventing or treating interstitial cystitis/bladder pain syndromeUNIV NAGOYA CITY PUBLIC UNIV CORP·Filed 2022·Application pending·0 cites
- 3662US2020216324A1Complex of lamellar inorganic compound and organic compound and method of producing thereof, delaminated lamellar inorganic compound and method of producing thereof, insulating resin composition, resin sheet, insulator, resin sheet cured product, and heat dissipating memberHITACHI CHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 3761US9782518B2Method for producing implant materialHOTTA YUJI·Filed 2011·Granted Oct 10, 2017·1 cites·4 claims
- 3860US8524128B2Method for production of porous ceramic materialKUWAYAMA TOMOYA·Filed 2008·Granted Sep 3, 2013·2 cites·5 claims
- 3960US6597192B2Test method of semiconductor deviceNITTO DENKO CORP·Filed 2000·Granted Jul 22, 2003·9 cites·6 claims
- 4060US4617224AThermal transfer recording mediumKONISHIROKU PHOTO IND·Filed 1984·Granted Oct 14, 1986·16 cites·20 claims
- 4159US4840886ASilver halide color photographic material containing a 1h-pyrazole (3,2-C)-s-triazole derived magenta couplerKONISHIROKU PHOTO IND·Filed 1988·Granted Jun 20, 1989·7 cites·11 claims
- 4258US6023096ASemiconductor device having metal foil integral with sealing resinNITTO DENKO CORP·Filed 1998·Granted Feb 8, 2000·22 cites·4 claims
- 4358US2024278621A1Vehicle component and method for manufacturing heater moduleTOYODA GOSEI KK·Filed 2024·Application pending·0 cites
- 4457US11643554B2Composite resin granules and method for producing the same, and thermally conductive resin molded body using composite resin granules and method for producing thermally conductive resin molded bodyAIST·Filed 2020·Granted May 9, 2023·0 cites·9 claims
- 4555US6846550B2Adhesive film for underfill and semiconductor device using the sameNITTO DENKO CORP·Filed 2003·Granted Jan 25, 2005·7 cites·4 claims
- 4655US5562993ASemiconductor device with identification informationNITTO DENKO CORP·Filed 1995·Granted Oct 8, 1996·13 cites·1 claims
- 4753US10081312B2Black plated resin part and method for manufacturing the sameTOYODA GOSEI KK·Filed 2016·Granted Sep 25, 2018·0 cites·10 claims
- 4853US2019301038A1Electroplating bath, method for manufacturing plated product, and plated productTOYODA GOSEI KK·Filed 2019·Application pending·0 cites
- 4953US2018044191A1Complex of lamellar inorganic compound and organic compound and method of producing thereof, delaminated lamellar inorganic compound and method of producing thereof, insulating resin composition, resin sheet, insulator, resin sheet cured product, and heat dissipating memberHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 5052US5904505AProcess for producing encapsulated semiconductor device having metal foil material covering and metal foilNITTO DENKO CORP·Filed 1997·Granted May 18, 1999·16 cites·1 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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