Inventor · disambiguated record
Hyo-Jic Jung
Also filed as: JUNG HYO J · JUNG HYO-JIC
8 granted patents·1 pending application·47 citations·filing 2006–2012
84Inventor score
Top patents by PatentIndex Score
9 records- 0188US7764149B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 27, 2010·18 cites·11 claims
- 0283US8598468B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2012·Granted Dec 3, 2013·5 cites·19 claims
- 0379US8699234B2EMI noise shield board including electromagnetic bandgap structureKIM HAN·Filed 2011·Granted Apr 15, 2014·6 cites·8 claims
- 0478US8164006B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2008·Granted Apr 24, 2012·6 cites·12 claims
- 0571US8258408B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Sep 4, 2012·5 cites·7 claims
- 0671US8212150B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Jul 3, 2012·5 cites·8 claims
- 0760US8314341B2Printed circuit board having electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Nov 20, 2012·1 cites·6 claims
- 0851US8242377B2Printed circuit board having electromagnetic bandgap structureJUNG HYO-JIC·Filed 2009·Granted Aug 14, 2012·1 cites·4 claims
- 0937US2007002545A1Semiconductor package board having dummy area with copper patternSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
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