Inventor · disambiguated record
Hideyuki Kurita
Also filed as: KURITA HIDEYUKI
25 granted patents·469 citations·filing 1996–2005
97Inventor score
Top patents by PatentIndex Score
25 records- 0189US5705852ANon-contact IC card and process for its productionSONY CHEMICALS CORP·Filed 1996·Granted Jan 6, 1998·147 cites·7 claims
- 0285US6404052B1Multi-layer flexible printed wiring boardSONY CHEMICALS CORP·Filed 2000·Granted Jun 11, 2002·36 cites·24 claims
- 0383US6583364B1Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Jun 24, 2003·21 cites·9 claims
- 0480US6399891B1Multilayer boardsSONY CHEMICALS CORP·Filed 2000·Granted Jun 4, 2002·24 cites·15 claims
- 0579US6420659B1Flexible wiring board pieces and wiring sheetsSONY CHEMICALS CORP·Filed 2000·Granted Jul 16, 2002·24 cites·15 claims
- 0677US6596947B1Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Jul 22, 2003·22 cites·21 claims
- 0775US6643923B1Processes for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 1999·Granted Nov 11, 2003·30 cites·13 claims
- 0873US6809267B1Flexible printed wiring board and its production methodSONY CHEMICALS CORP·Filed 2000·Granted Oct 26, 2004·17 cites·10 claims
- 0970US6729022B2Processes for manufacturing flexible wiring boards and the resulting flexible wiring boardsSONY CHEMICALS CORP·Filed 2002·Granted May 4, 2004·12 cites·13 claims
- 1067US7005323B2Method and apparatus for shielding integrated circuitsRFSTREAM CORP·Filed 2005·Granted Feb 28, 2006·3 cites·13 claims
- 1164US6926187B2Ultrasonic manufacturing apparatusSONY CHEMICALS CORP·Filed 2003·Granted Aug 9, 2005·7 cites·5 claims
- 1261US6848176B2Process for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 2003·Granted Feb 1, 2005·6 cites·13 claims
- 1361US6448647B1BGA package substrateSONY CHEMICALS CORP·Filed 1998·Granted Sep 10, 2002·26 cites·6 claims
- 1460US6437251B1Flexible board made by joining two pieces through an adhesive filmSONY CHEMICALS CORP·Filed 2000·Granted Aug 20, 2002·9 cites·4 claims
- 1560US6323434B1Circuit board and production method thereofSONY CHEMICALS CORP·Filed 1998·Granted Nov 27, 2001·21 cites·9 claims
- 1656US6717064B1Substrate piece and flexible substrateSONY CHEMICALS CORP·Filed 2000·Granted Apr 6, 2004·6 cites·6 claims
- 1756US6658722B1Process for producing magnetic head suspensionSONY CHEMICALS CORP·Filed 1999·Granted Dec 9, 2003·16 cites·5 claims
- 1855US7053312B2Flexible wiring boardsSONY CHEMICALS CORP·Filed 2003·Granted May 30, 2006·4 cites·6 claims
- 1954US6840430B2Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 2003·Granted Jan 11, 2005·5 cites·16 claims
- 2053US6344308B1Method of manufacturing a flexible circuit boardSONY CHEMICALS CORP·Filed 1999·Granted Feb 5, 2002·15 cites·6 claims
- 2152US6991148B2Process for manufacturing multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2003·Granted Jan 31, 2006·3 cites·17 claims
- 2252US6737588B1Processes for manufacturing flexible wiring boards and the resulting flexible wiring boardSONY CHEMICALS CORP·Filed 2000·Granted May 18, 2004·3 cites·6 claims
- 2349US7213334B2Method for manufacturing double-sided flexible printed boardSONY CHEM & INF DEVICE CORP·Filed 2003·Granted May 8, 2007·2 cites·6 claims
- 2446US6812060B1Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Nov 2, 2004·2 cites·14 claims
- 2544US6705007B1Method for manufacturing double-sided flexible printed boardSONY CHEMICALS CORP·Filed 1999·Granted Mar 16, 2004·8 cites·3 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →