Inventor · disambiguated record
Michio Sono
Also filed as: SONO MICHIO
28 granted patents·1,604 citations·filing 1985–2000
98Inventor score
Technology areasH10W
Files withFUJITSU LTD28
Top patents by PatentIndex Score
28 records- 0195US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0293US5801439ASemiconductor device and semiconductor device unit for a stack arrangementFUJITSU LTD·Filed 1997·Granted Sep 1, 1998·168 cites·20 claims
- 0392US5920117ASemiconductor device and method of forming the deviceFUJITSU LTD·Filed 1997·Granted Jul 6, 1999·135 cites·12 claims
- 0492US5451815ASemiconductor device with surface mount package adapted for vertical mountingFUJITSU LTD·Filed 1994·Granted Sep 19, 1995·134 cites·21 claims
- 0586US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 0686US5521432ASemiconductor device having improved leads comprising palladium plated nickelFUJITSU LTD·Filed 1994·Granted May 28, 1996·84 cites·32 claims
- 0785US4788583ASemiconductor device and method of producing semiconductor deviceFUJITSU LTD·Filed 1987·Granted Nov 29, 1988·72 cites·16 claims
- 0883US5804468AProcess for manufacturing a packaged semiconductor having a divided leadframe stageFUJITSU LTD·Filed 1995·Granted Sep 8, 1998·65 cites·4 claims
- 0983US5497032ASemiconductor device and lead frame thereforeFUJITSU LTD·Filed 1994·Granted Mar 5, 1996·65 cites·45 claims
- 1083US4661837AResin-sealed radiation shield for a semiconductor deviceFUJITSU LTD·Filed 1985·Granted Apr 28, 1987·63 cites·7 claims
- 1182US5760471ASemiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic packageFUJITSU LTD·Filed 1997·Granted Jun 2, 1998·71 cites·12 claims
- 1277US5703398ASemiconductor integrated circuit device and method of producing the semiconductor integrated circuit deviceFUJITSU LTD·Filed 1996·Granted Dec 30, 1997·51 cites·15 claims
- 1376US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 1474US5786985ASemiconductor device and semiconductor device unitFUJITSU LTD·Filed 1996·Granted Jul 28, 1998·47 cites·22 claims
- 1574US5424251AMethod of producing semiconductor device having radiation part made of resin containing insulator powdersFUJITSU LTD·Filed 1993·Granted Jun 13, 1995·41 cites·9 claims
- 1671US5747874ASemiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1995·Granted May 5, 1998·37 cites·27 claims
- 1771US5444025AProcess for encapsulating a semiconductor package having a heat sink using a jigFUJITSU LTD·Filed 1994·Granted Aug 22, 1995·39 cites·12 claims
- 1867US6022759AMethod for producing a semiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1998·Granted Feb 8, 2000·31 cites·8 claims
- 1967US5305179ASurface-mounting type semiconductor package having an improved efficiency for heat dissipationFUJITSU LTD·Filed 1992·Granted Apr 19, 1994·39 cites·16 claims
- 2061US5684675ASemiconductor device unit having holderFUJITSU LTD·Filed 1994·Granted Nov 4, 1997·30 cites·23 claims
- 2158US5574310ASemiconductor package for surface mounting with reinforcing members on support legsFUJITSU LTD·Filed 1995·Granted Nov 12, 1996·21 cites·14 claims
- 2255US5296740AMethod and apparatus for a semiconductor device having a radiation partFUJITSU LTD·Filed 1992·Granted Mar 22, 1994·20 cites·6 claims
- 2347US5309016ASemiconductor integrated circuit device having terminal members provided between semiconductor element and leadsFUJITSU LTD·Filed 1992·Granted May 3, 1994·14 cites·18 claims
- 2445US5659200ASemiconductor device having radiator structureFUJITSU LTD·Filed 1995·Granted Aug 19, 1997·11 cites·12 claims
- 2543US5861669ASemiconductor package for surface mountingFUJITSU LTD·Filed 1995·Granted Jan 19, 1999·10 cites·38 claims
- 2633US5361970AMethod of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leadsFUJITSU LTD·Filed 1994·Granted Nov 8, 1994·4 cites·14 claims
- 2731US5831332ASemiconductor package for surface mountingFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·1 cites·21 claims
- 2828US5343615ASemiconductor device and a process for making same having improved leadsFUJITSU LTD·Filed 1992·Granted Sep 6, 1994·2 cites·5 claims
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