Inventor · disambiguated record
Magdalena Hoier
Also filed as: HOIER MAGDALENA
7 granted patents·19 citations·filing 2013–2019
77Inventor score
Files withINFINEON TECHNOLOGIES AG7
Top patents by PatentIndex Score
7 records- 0189US10242969B2Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 26, 2019·12 cites·13 claims
- 0277US9196510B2Semiconductor package comprising two semiconductor modules and laterally extending connectorsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 24, 2015·4 cites·17 claims
- 0375US10211158B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 19, 2019·3 cites·13 claims
- 0456US11322451B2Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 3, 2022·0 cites·9 claims
- 0548US9756726B2Electronic device and method of fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 5, 2017·0 cites·15 claims
- 0643US9924594B2Power semiconductor module and method for producing a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 20, 2018·0 cites·8 claims
- 0743US9780053B2Method of forming a bondpad and bondpadINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 3, 2017·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →