Inventor · disambiguated record
Tetsuo Kumazawa
Also filed as: KUMAZAWA TETSUO
19 granted patents·1,106 citations·filing 1979–2003
96Inventor score
Top patents by PatentIndex Score
19 records- 0199US5608265AEncapsulated semiconductor device package having holes for electrically conductive materialHITACHI LTD·Filed 1994·Granted Mar 4, 1997·567 cites·54 claims
- 0293US5569960AElectronic component, electronic component assembly and electronic component unitHITACHI LTD·Filed 1995·Granted Oct 29, 1996·105 cites·38 claims
- 0389US5195155AOptical coupling apparatus and manufacturing method of the same, and lens holderHITACHI LTD·Filed 1990·Granted Mar 16, 1993·107 cites·2 claims
- 0488US4528223AComposite fibrous productHITACHI LTD·Filed 1981·Granted Jul 9, 1985·49 cites·13 claims
- 0585US4446191ALaminates comprising prepregs metal cladHITACHI CHEMICAL CO LTD·Filed 1981·Granted May 1, 1984·39 cites·16 claims
- 0679US6455335B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2000·Granted Sep 24, 2002·17 cites·10 claims
- 0778US4880290AOpto-electronic device and method for producing the deviceHITACHI LTD·Filed 1987·Granted Nov 14, 1989·40 cites·27 claims
- 0877US6566150B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2002·Granted May 20, 2003·15 cites·1 claims
- 0967US5046798ASemiconductor light emitting device and apparatus using the sameHITACHI LTD·Filed 1989·Granted Sep 10, 1991·33 cites·13 claims
- 1064US5671316AConnecting structure of optical fiber to optical waveguideHITACHI CABLE·Filed 1996·Granted Sep 23, 1997·28 cites·21 claims
- 1164US4251746ADirect-heated cathode structureHITACHI LTD·Filed 1979·Granted Feb 17, 1981·11 cites·11 claims
- 1262US6049128ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 11, 2000·21 cites·10 claims
- 1361US6130112ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Oct 10, 2000·20 cites·7 claims
- 1461US5637914ALead frame and semiconductor device encapsulated by resinHITACHI LTD·Filed 1995·Granted Jun 10, 1997·24 cites·38 claims
- 1553US6197603B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 1998·Granted Mar 6, 2001·12 cites·4 claims
- 1650US7198962B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2003·Granted Apr 3, 2007·3 cites·5 claims
- 1748US4335329AMask support for shadow mask assemblyHITACHI LTD·Filed 1980·Granted Jun 15, 1982·6 cites·8 claims
- 1846US6297073B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 2, 2001·1 cites·8 claims
- 1941US5837567ALead frame and semiconductor deviceHITACHI LTD·Filed 1997·Granted Nov 17, 1998·8 cites·26 claims
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