Inventor · disambiguated record
Takuro Iwamura
Also filed as: IWAMURA TAKURO
9 granted patents·211 citations·filing 1986–1994
90Inventor score
Top patents by PatentIndex Score
9 records- 0180US5143355AApparatus for manufacturing oxygen-free copperMITSUBISHI MATERIALS CORP·Filed 1991·Granted Sep 1, 1992·23 cites·14 claims
- 0279US5037471AMethod for manufacturing oxygen-free copperMITSUBISHI METAL CORP·Filed 1989·Granted Aug 6, 1991·22 cites·7 claims
- 0378US4749548ACopper alloy lead material for use in semiconductor deviceMITSUBISHI METAL CORP·Filed 1986·Granted Jun 7, 1988·45 cites·4 claims
- 0472US4872048ASemiconductor device having copper alloy leadsMITSUBISHI METAL CORP·Filed 1988·Granted Oct 3, 1989·34 cites·4 claims
- 0569US4901550AManufacturing method of extra fine wireMITSUBISHI METAL CORP·Filed 1988·Granted Feb 20, 1990·38 cites·12 claims
- 0661US5705125AWire for electric railwaysMITSUBISHI MATERIALS CORP·Filed 1994·Granted Jan 6, 1998·22 cites·18 claims
- 0760US5391243AMethod for producing wire for electric railwaysMITSUBISHI MATERIALS CORP·Filed 1993·Granted Feb 21, 1995·14 cites·74 claims
- 0857US4830086AMold member and rapidly solidifying water cooled rotary roll memberMITSUBISHI METAL CORP·Filed 1988·Granted May 16, 1989·7 cites·4 claims
- 0945US4886641AElectrical contact spring material made of copper base alloy of high strength and toughness with reduced anisotropy in characteristicsMITSUBISHI METAL CORP·Filed 1988·Granted Dec 12, 1989·6 cites·11 claims
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