Inventor · disambiguated record
Harumi Negishi
Also filed as: NEGISHI HARUMI
3 granted patents·3 pending applications·21 citations·filing 1998–2025
64Inventor score
Top patents by PatentIndex Score
6 records- 0170US12256490B2Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Mar 18, 2025·0 cites·16 claims
- 0266US2025234456A1Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageRESONAC CORP·Filed 2025·Application pending·0 cites
- 0357US6156831AModified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Dec 5, 2000·18 cites·10 claims
- 0448US6465083B1Method of making varnish of modified cyanate ester group curable resin composition, and prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the compositionHITACHI CHEMICAL CO LTD·Filed 2000·Granted Oct 15, 2002·3 cites·30 claims
- 0546US2006099391A1Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the sameTOMIOKA KENICHI·Filed 2005·Application pending·0 cites
- 0637US2019030873A1Aerogel laminate and thermal insulation materialHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
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