Inventor · disambiguated record
Motoaki Wakui
Also filed as: WAKUI MOTOAKI
5 granted patents·1 pending application·67 citations·filing 2003–2010
81Inventor score
Top patents by PatentIndex Score
6 records- 0188US7919875B2Semiconductor device with recess portion over pad electrodeSANYO ELECTRIC CO·Filed 2007·Granted Apr 5, 2011·16 cites·4 claims
- 0278US7456083B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2005·Granted Nov 25, 2008·22 cites·13 claims
- 0373US7312107B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Dec 25, 2007·17 cites·13 claims
- 0464US8692370B2Semiconductor device with copper wire ball-bonded to electrode pad including buffer layerKITAZAWA TAKASHI·Filed 2010·Granted Apr 8, 2014·4 cites·4 claims
- 0556US7064046B2Manufacturing method of semiconductor deviceKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Jun 20, 2006·8 cites·12 claims
- 0637US2004121562A1Method for manufacturing a semiconductor device having multiple laminated layers of different materialsSANYO ELECTRIC CO·Filed 2003·Application pending·0 cites
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