Inventor · disambiguated record
Jaeung Koo
Also filed as: KOO JAEUNG
5 granted patents·21 citations·filing 2006–2022
70Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0188US7452817B2CMP method providing reduced thickness variationsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·18 cites·25 claims
- 0278US11094586B2Semiconductor device including interconnections having different structures and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·20 claims
- 0353US12400907B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0448US12464795B2Method of manufacturing semiconductor device using single slurry chemical mechanical polishing (CMP) processSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·17 claims
- 0545US12513982B2Semiconductor device having an isolation structure between adjacent source/drain regionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →