Inventor · disambiguated record

Fujio Furukawa

Also filed as: FURUKAWA FUJIO

1 granted patent·2 citations·filing 2013–2013

19Inventor score

Technology areasH10W

Files withOTSUKA TAKAYUKI1

Top patents by PatentIndex Score

1 record

0160US8847371B2Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing sameOTSUKA TAKAYUKI·Filed 2013·Granted Sep 30, 2014·2 cites·4 claims

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Fujio Furukawa — Patent Inventor | PatentIndex