Inventor · disambiguated record
Shuji Uozumi
Also filed as: UOZUMI SHUJI
9 granted patents·3 pending applications·1 citations·filing 2016–2023
74Inventor score
Top patents by PatentIndex Score
12 records- 0179US11383345B2Cleaning apparatus for heat exchanger and polishing apparatusEBARA CORP·Filed 2020·Granted Jul 12, 2022·1 cites·19 claims
- 0270US2023356267A1Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatusEBARA CORP·Filed 2023·Application pending·0 cites
- 0363US2022347814A1Polishing apparatus and polishing methodEBARA CORP·Filed 2022·Application pending·0 cites
- 0457US12472601B2Method of checking leakage of fluid and polishing apparatusEBARA CORP·Filed 2019·Granted Nov 18, 2025·0 cites·7 claims
- 0557US2020276619A1Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatusEBARA CORP·Filed 2020·Application pending·0 cites
- 0655US11826871B2Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatusEBARA CORP·Filed 2021·Granted Nov 28, 2023·0 cites·15 claims
- 0754US12368059B2Substrate cleaning apparatus, substrate processing apparatus, substrate cleaning method, device manufacturing method, and non-transitory computer readable mediumEBARA CORP·Filed 2021·Granted Jul 22, 2025·0 cites·15 claims
- 0851US12181345B2Method of calibrating radiation thermometer and system thereofEBARA CORP·Filed 2020·Granted Dec 31, 2024·0 cites·16 claims
- 0951US11618111B2Method of manufacturing plate-shaped solder and manufacturing deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 4, 2023·0 cites·13 claims
- 1051US11517940B2Substrate cleaning deviceEBARA CORP·Filed 2019·Granted Dec 6, 2022·0 cites·8 claims
- 1150US11992915B2System for adjusting pad surface temperature and polishing apparatusEBARA CORP·Filed 2020·Granted May 28, 2024·0 cites·13 claims
- 1245US11213921B2Device for manufacturing plate solder and method for manufacturing plate solderMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 4, 2022·0 cites·6 claims
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