Inventor · disambiguated record
Manu J. Prakuzhy
Also filed as: PRAKUZHY MANU J · PRAKUZHY MANU JOSEPH
10 granted patents·1 pending application·14 citations·filing 2014–2024
81Inventor score
Files withTEXAS INSTRUMENTS INC11
Top patents by PatentIndex Score
11 records- 0191US9165873B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 20, 2015·10 cites·14 claims
- 0278US9373572B2Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·2 cites·20 claims
- 0376US10622290B2Packaged multichip module with conductive connectorsTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 14, 2020·2 cites·19 claims
- 0470US11901271B2High current packages with reduced solder layer countTEXAS INSTRUMENTS INC·Filed 2022·Granted Feb 13, 2024·0 cites·27 claims
- 0563US11545420B2High current packages with reduced solder layer countTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 3, 2023·0 cites·23 claims
- 0661US11538742B2Packaged multichip module with conductive connectorsTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 27, 2022·0 cites·18 claims
- 0761US2025372529A1Iii-n semiconductor device with reduced scribeline vulnerabilityTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0851US10607927B2Spot-solderable leads for semiconductor device packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted Mar 31, 2020·0 cites·8 claims
- 0947US12412800B2Integrated circuit package having enhanced thermal dissipation structureTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 9, 2025·0 cites·19 claims
- 1047US9142496B1Semiconductor package having etched foil capacitor integrated into leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 22, 2015·0 cites·4 claims
- 1146US10497643B1Patterned die pad for packaged vertical semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Dec 3, 2019·0 cites·19 claims
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