Inventor · disambiguated record
Volume Chien
Also filed as: CHIEN VOLUME
83 granted patents·2 pending applications·201 citations·filing 2002–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD62TAIWAN SEMICONDUCTOR MFG18JANGJIAN SHIU-KO1LIN JENG-SHYAN1SHIH YU-HAO1
Top patents by PatentIndex Score
85 records- 0194US10181491B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 15, 2019·6 cites·20 claims
- 0294US9281338B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·10 cites·20 claims
- 0393US10276620B2Image sensor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 30, 2019·9 cites·20 claims
- 0493US9543353B2Formation of buried color filters in a back side illuminated image sensor with an ONO-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 10, 2017·6 cites·20 claims
- 0593US9024369B2Metal shield structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 5, 2015·8 cites·20 claims
- 0692US9368531B2Formation of buried color filters in a back side illuminated image sensor with an ono-like structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 14, 2016·9 cites·20 claims
- 0791US9553118B2Formation of buried color filters in a back side illuminated image sensor using an etching-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 24, 2017·7 cites·20 claims
- 0891US9293490B2Deep trench isolation with air-gap in backside illumination image sensor chipsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·9 cites·20 claims
- 0990US10770502B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·3 cites·20 claims
- 1088US10269684B2Semiconductor structure and manufacuting method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 1188US9825085B2Formation of buried color filters in a back side illuminated image sensor using an etching-stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 21, 2017·5 cites·20 claims
- 1288US9786710B2Image sensor device with sub-isolation in pixelsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·7 cites·18 claims
- 1388US9123839B2Image sensor with stacked grid structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 1, 2015·8 cites·20 claims
- 1488US8816415B2Photodiode with concave reflectorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 26, 2014·4 cites·12 claims
- 1586US9627426B2Image sensor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 18, 2017·6 cites·20 claims
- 1686US9324752B2Image sensor device with light blocking structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 26, 2016·4 cites·20 claims
- 1785US10490590B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·2 cites·20 claims
- 1885US9768221B2Pad structure layout for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·8 cites·19 claims
- 1985US9397129B2Dielectric film for image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·3 cites·20 claims
- 2084US12288798B2Backside illuminated image sensor device with shielding layer and forming methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 2184US9640456B2Support structure for integrated circuitryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 2, 2017·5 cites·20 claims
- 2283US10192918B2Image sensor including dual isolation and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 29, 2019·3 cites·20 claims
- 2383US10056426B2Apparatus and method for fabricating a light guiding gridTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 21, 2018·5 cites·20 claims
- 2483US9548329B2Backside illuminated image sensor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 17, 2017·6 cites·20 claims
- 2583US9461089B2Method of fabricating semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 4, 2016·2 cites·20 claims
- 2683US9252180B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 2, 2016·5 cites·20 claims
- 2782US9060144B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 16, 2015·4 cites·10 claims
- 2882US8962375B2Method of making a reflective shieldTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 24, 2015·2 cites·20 claims
- 2981US11735619B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 3081US8629523B2Inserted reflective shield to improve quantum efficiency of image sensorsSHIH YU-HAO·Filed 2010·Granted Jan 14, 2014·4 cites·20 claims
- 3181US2025261458A1Backside illuminated image sensor device with shielding layer and forming methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3280US9196547B2Dual shallow trench isolation and related applicationsLIN JENG-SHYAN·Filed 2010·Granted Nov 24, 2015·4 cites·19 claims
- 3379US10340301B2Support structure for integrated circuitryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 2, 2019·2 cites·20 claims
- 3479US9591242B2Black level control for image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 7, 2017·3 cites·20 claims
- 3578US11810939B2Method of forming backside illuminated image sensor device with shielding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 3678US11011566B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 18, 2021·2 cites·20 claims
- 3778US6863796B2Method for reducing cu surface defects following cu ECPTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 8, 2005·12 cites·19 claims
- 3876US11778320B2Method of manufacturing integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 3976US9786716B2Method of fabricating semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·1 cites·20 claims
- 4075US11355545B2Semiconductor image sensor device having back side illuminated image sensors with embedded color filtersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 4175US11227886B2Mechanisms for forming image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 4275US9659859B2Metal pad offset for multi-layer metal layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 4374US10797094B2Mechanisms for forming image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 4474US10163966B2Image sensing device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·2 cites·20 claims
- 4574US9478578B2Stress release layout and associated methods and devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·1 cites·20 claims
- 4674US9473719B2Protection layer in CMOS image sensor array regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 18, 2016·2 cites·20 claims
- 4773US10515991B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 24, 2019·2 cites·9 claims
- 4873US9247116B2Image sensor device with light guiding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 26, 2016·2 cites·20 claims
- 4973US9142588B2Backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 22, 2015·2 cites·20 claims
- 5072US9543343B2Mechanisms for forming image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·1 cites·20 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →