Inventor · disambiguated record

Trancy Tsao

Also filed as: TSAO TRANCY

1 granted patent·48 citations·filing 1995–1995

49Inventor score

Technology areasH10W

Files withMICROUNIT SYSTEMS ENGINEERING1

Top patents by PatentIndex Score

1 record

0168US5985692AProcess for flip-chip bonding a semiconductor die having gold bump electrodesMICROUNIT SYSTEMS ENGINEERING·Filed 1995·Granted Nov 16, 1999·48 cites·31 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →