Inventor · disambiguated record
Wei Huang
Also filed as: HUANG WEI · HUANG WEI-KUO
16 granted patents·4 pending applications·9 citations·filing 2007–2022
87Inventor score
Files withSENSORS UNLIMITED INC15HUANG WEI-KUO2GLOBALWAFERS CO LTD1HSIN YUE-MING1NOVATEK MICROELECTRONICS CORP1
Top patents by PatentIndex Score
20 records- 0192US10957733B2Interconnect bump structures for photo detectorsSENSORS UNLIMITED INC·Filed 2020·Granted Mar 23, 2021·3 cites·11 claims
- 0278US10134791B1Backside illumination global shutter sensor and pixel thereofNOVATEK MICROELECTRONICS CORP·Filed 2017·Granted Nov 20, 2018·3 cites·20 claims
- 0376US10727267B2Interconnect bump structures for photo detectorsSENSORS UNLIMITED INC·Filed 2018·Granted Jul 28, 2020·2 cites·9 claims
- 0469US10566371B2Bump structures for interconnecting focal plane arraysSENSORS UNLIMITED INC·Filed 2018·Granted Feb 18, 2020·1 cites·6 claims
- 0562US10879204B2Bump structures for high density flip chip interconnectionSENSORS UNLIMITED INC·Filed 2020·Granted Dec 29, 2020·0 cites·14 claims
- 0661US11251210B2Pin diodes with over-current protectionSENSORS UNLIMITED INC·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 0760US10971531B2PixelsSENSORS UNLIMITED INC·Filed 2020·Granted Apr 6, 2021·0 cites·7 claims
- 0856US10622324B2Bump structures for high density flip chip interconnectionSENSORS UNLIMITED INC·Filed 2018·Granted Apr 14, 2020·0 cites·7 claims
- 0955US11251219B2Low capacitance photo detectorsSENSORS UNLIMITED INC·Filed 2020·Granted Feb 15, 2022·0 cites·11 claims
- 1052US12051665B2Hybridization bumps for fine pitch sensor arraysSENSORS UNLIMITED INC·Filed 2022·Granted Jul 30, 2024·0 cites·7 claims
- 1152US11495631B2Pin mesa diodes with over-current protectionSENSORS UNLIMITED INC·Filed 2020·Granted Nov 8, 2022·0 cites·15 claims
- 1251US2023299223A1Photodiode structuresSENSORS UNLIMITED INC·Filed 2022·Application pending·0 cites
- 1349US10468437B2Mesas and implants in two-dimensional arraysSENSORS UNLIMITED INC·Filed 2018·Granted Nov 5, 2019·0 cites·20 claims
- 1447US10096639B2Bump structures for interconnecting focal plane arraysSENSORS UNLIMITED INC·Filed 2016·Granted Oct 9, 2018·0 cites·6 claims
- 1545US2010077565A1Hinge capable of being positioned at any angleHUANG WEI-KUO·Filed 2008·Application pending·0 cites
- 1644US8237238B2Image sensorHUANG WEI-KUO·Filed 2010·Granted Aug 7, 2012·0 cites·16 claims
- 1741US10529753B2PixelsSENSORS UNLIMITED INC·Filed 2015·Granted Jan 7, 2020·0 cites·6 claims
- 1837US2009001489A1Silicon photodetector and method for forming the sameHSIN YUE-MING·Filed 2007·Application pending·0 cites
- 1936US9716123B2Photodiode arraysSENSORS UNLIMITED INC·Filed 2015·Granted Jul 25, 2017·0 cites·11 claims
- 2031US2018358443A1Silicon carbide wafer and positioning edge processing method thereofGLOBALWAFERS CO LTD·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →