Inventor · disambiguated record
Wei-Ming Chien
Also filed as: CHIEN WEI-MING
13 granted patents·6 pending applications·18 citations·filing 2012–2025
85Inventor score
Files withXINTEC INC15SU SHU-TE1UNIV OF WASHINGTON - CENTER FOR COMMERCIALIZATION1UNIV WASHINGTON1WISTRON CORP1
Top patents by PatentIndex Score
19 records- 0183US8886864B1Interface card apparatusWISTRON CORP·Filed 2013·Granted Nov 11, 2014·12 cites·20 claims
- 0270US9550981B2Modified tafazzin proteins and methods of making and using the sameUNIV OF WASHINGTON CENTER FOR COMMERCIALIZATION·Filed 2015·Granted Jan 24, 2017·2 cites·30 claims
- 0370US9331256B2Semiconductor structure with sensor chip and landing padsXINTEC INC·Filed 2014·Granted May 3, 2016·2 cites·13 claims
- 0463US9640683B2Electrical contact structure with a redistribution layer connected to a studXINTEC INC·Filed 2015·Granted May 2, 2017·1 cites·10 claims
- 0562US10096635B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2015·Granted Oct 9, 2018·1 cites·16 claims
- 0660US2024304582A1Circuit substrate in chip package and method for forming the sameXINTEC INC·Filed 2024·Application pending·0 cites
- 0759US2025174574A1Chip package with electrical shielding structure and mesh pad structureXINTEC INC·Filed 2024·Application pending·0 cites
- 0857US11355659B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Jun 7, 2022·0 cites·15 claims
- 0957US2023361144A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 1054US12500141B2Semiconductor device structure and semiconductor package assemblyXINTEC INC·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 1151US11310904B2Chip package and power moduleXINTEC INC·Filed 2019·Granted Apr 19, 2022·0 cites·14 claims
- 1251US2025316548A1Chip package and manufacturing method thereofXINTEC INC·Filed 2025·Application pending·0 cites
- 1350US9780251B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2017·Granted Oct 3, 2017·0 cites·9 claims
- 1449US9450015B2Manufacturing method of semiconductor structureXINTEC INC·Filed 2016·Granted Sep 20, 2016·0 cites·5 claims
- 1546US9214579B2Electrical contact structure with a redistribution layer connected to a studXINTEC INC·Filed 2014·Granted Dec 15, 2015·0 cites·14 claims
- 1642US10086040B2Methods for treating and preventing cardiomyopathy with a fusion protein of tafazzin and a cellular permeability peptideUNIV WASHINGTON·Filed 2015·Granted Oct 2, 2018·0 cites·20 claims
- 1742US9613919B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 1832US2017098678A1Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 1930US2013178112A1Connection Interface and CableSU SHU-TE·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →