Inventor · disambiguated record
Min Cheol An
Also filed as: AN MIN C · AN MIN CHEOL
5 granted patents·667 citations·filing 1994–1998
87Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0196US5744827AThree dimensional stack package device having exposed coupling lead portions and vertical interconnection elementsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Apr 28, 1998·312 cites·28 claims
- 0290US5804874AStacked chip package device employing a plurality of lead on chip type semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 8, 1998·146 cites·12 claims
- 0382US5450289ASemiconductor package and a printed circuit board applicable to its mountingSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Sep 12, 1995·104 cites·11 claims
- 0479US6028774ABase cards and IC cards using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 22, 2000·80 cites·20 claims
- 0557US6104095APrinted circuit board and chip-on-board packages using sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Aug 15, 2000·25 cites·11 claims
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