Inventor · disambiguated record
Keisuke Ikeno
Also filed as: Ikeno keisuke
4 granted patents·2 citations·filing 2017–2018
57Inventor score
Technology areasH10W
Files withMURATA MANUFACTURING CO4
Top patents by PatentIndex Score
4 records- 0172US10103092B2Multilayer substrate, component mounted board, and method for producing component mounted boardMURATA MANUFACTURING CO·Filed 2017·Granted Oct 16, 2018·2 cites·19 claims
- 0242US10256209B2Resin substrate, component-mounted resin substrate, method of manufacturing resin substrate, and method of manufacturing component-mounted resin substrateMURATA MANUFACTURING CO·Filed 2018·Granted Apr 9, 2019·0 cites·19 claims
- 0338US9972567B2Multilayer substrate, component mounted board, and method for producing component mounted boardMURATA MANUFACTURING CO·Filed 2017·Granted May 15, 2018·0 cites·19 claims
- 0437US10166747B2Resin multilayer substrate and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2018·Granted Jan 1, 2019·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →