Inventor · disambiguated record
Hisatoshi Murakami
Also filed as: MURAKAMI HISATOSHI
9 granted patents·308 citations·filing 1987–2003
91Inventor score
Top patents by PatentIndex Score
9 records- 0188US4801489APrinted circuit board capable of preventing electromagnetic interferenceNINTENDO CO LTD·Filed 1987·Granted Jan 31, 1989·67 cites·35 claims
- 0284US4789411AConductive copper paste compositionTATSUTA DENSEN KK·Filed 1987·Granted Dec 6, 1988·52 cites·26 claims
- 0382US5981043AElectroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shieldTATSUTA DENSEN KK·Filed 1997·Granted Nov 9, 1999·74 cites·5 claims
- 0477US7214419B2Conductive paste multilayered board including the conductive paste and process for producing the sameTATSUTA DENSEN KK·Filed 2003·Granted May 8, 2007·20 cites·8 claims
- 0572US5341274APrinted circuit board with enhanced EMI suppressionTATSUTA DENSEN KK·Filed 1990·Granted Aug 23, 1994·31 cites·5 claims
- 0660US5736070AElectroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shieldTATSUTA DENSEN KK·Filed 1996·Granted Apr 7, 1998·27 cites·6 claims
- 0754US5466893APrinted circuit board having enhanced EMI suppressionTATSUTA DENSEN KK·Filed 1994·Granted Nov 14, 1995·18 cites·7 claims
- 0847US5449863APrinted circuit boardTATSUTA DENSEN KK·Filed 1994·Granted Sep 12, 1995·11 cites·13 claims
- 0942US5779941A1,2-N-acyl-N-methylene-ethylenediamine, and electroconductive paste comprising itTATSUTA DENSEN KK·Filed 1997·Granted Jul 14, 1998·8 cites·6 claims
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