Inventor · disambiguated record
Shang-Yi Wu
Also filed as: WU SHANG-YI
20 granted patents·15 pending applications·52 citations·filing 2002–2024
92Inventor score
Top patents by PatentIndex Score
35 records- 0183US10215937B1Optoelectronic packageUNISTARS CORP·Filed 2018·Granted Feb 26, 2019·6 cites·10 claims
- 0273US8866268B2Semiconductor package structure and manufacturing method thereofWU SHANG-YI·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 0373US8431950B2Light emitting device package structure and fabricating method thereofTSAI CHIA-LUN·Filed 2009·Granted Apr 30, 2013·5 cites·10 claims
- 0473US7630125B2Laser moduleYOUNG OPTICS INC·Filed 2007·Granted Dec 8, 2009·4 cites·19 claims
- 0568US10062815B1Light emitting device and method of manufacturing the sameUNISTARS CORP·Filed 2017·Granted Aug 28, 2018·2 cites·19 claims
- 0667US8558262B2High-reflection submount for light-emitting diode package and fabrication method thereofWU SHANG-YI·Filed 2011·Granted Oct 15, 2013·2 cites·7 claims
- 0767US8237187B2Package structure for chip and method for forming the sameHUANG TIEN-HAO·Filed 2009·Granted Aug 7, 2012·6 cites·20 claims
- 0867US7862178B2Scanning projection apparatusYOUNG OPTICS INC·Filed 2007·Granted Jan 4, 2011·2 cites·25 claims
- 0967US7170671B2High efficiency wavelength convertersHC PHOTONICS CORP·Filed 2004·Granted Jan 30, 2007·14 cites·22 claims
- 1064US7677758B2Display method and illumination system thereofYOUNG OPTICS INC·Filed 2008·Granted Mar 16, 2010·1 cites·20 claims
- 1163US7207685B2Reflector module with image correction capabilityYOUNG OPTICS INC·Filed 2005·Granted Apr 24, 2007·3 cites·10 claims
- 1262US9209371B2Semiconductor construction, semiconductor unit, and manufacturing method thereofUNISTARS·Filed 2013·Granted Dec 8, 2015·2 cites·10 claims
- 1361US2025145082A1In-vehicle device and driving trajectory projection methodMITAC DIGITAL TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1457US8174044B2Light emitting diode package and method for forming the sameWU SHANG-YI·Filed 2010·Granted May 8, 2012·1 cites·20 claims
- 1553US8778707B2High-reflection submount for light-emitting diode package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jul 15, 2014·0 cites·13 claims
- 1648US7839553B2Light source moduleYOUNG OPTICS INC·Filed 2007·Granted Nov 23, 2010·0 cites·8 claims
- 1748US2015226382A1Electroluminescent device and apparatus applying the sameUNISTARS CORP·Filed 2014·Application pending·0 cites
- 1845US2008018602A1Optical mouseYOUNG OPTICS INC·Filed 2007·Application pending·0 cites
- 1944US9059384B2LED packaging construction and manufacturing method thereofUNISTARS·Filed 2013·Granted Jun 16, 2015·0 cites·15 claims
- 2044US2009022187A1Laser moduleYOUNG OPTICS INC·Filed 2008·Application pending·0 cites
- 2142US2009141749A1Laser moduleYOUNG OPTICS INC·Filed 2007·Application pending·0 cites
- 2242US2014247585A1Semiconductor lighting apparatusUNISTARS CORP·Filed 2013·Application pending·0 cites
- 2341US2015060911A1Optoelectronic semiconductor device and fabricating method thereofUNISTARS CORP·Filed 2013·Application pending·0 cites
- 2440US8866313B2Substrate, semiconductor construction, and manufacturing method thereofUNISTARS CORP·Filed 2013·Granted Oct 21, 2014·0 cites·21 claims
- 2539US10153459B2Optoelectronic packageUNISTARS CORP·Filed 2017·Granted Dec 11, 2018·0 cites·14 claims
- 2639US2011284887A1Light emitting chip package and method for forming the sameWU SHANG-YI·Filed 2010·Application pending·0 cites
- 2739US2011303936A1Light emitting device package structure and fabricating method thereofWU SHANG-YI·Filed 2010·Application pending·0 cites
- 2836US2011170303A1Chip package and fabrication method thereofWU SHANG-YI·Filed 2011·Application pending·0 cites
- 2936US2003127042A1Method of forming high quality waveguides by vapor-phase proton-exchange process with post-thermal annealing and reversed proton-exchangeFiled 2002·Application pending·0 cites
- 3035US2017236973A1Packaging method for ultraviolet light emitting diodeUNISTARS CORP·Filed 2016·Application pending·0 cites
- 3134US10651354B2Optoelectronic package with a low water vapor transmission rate (WVTR) and method for fabricating the sameUNISTARS CORP·Filed 2017·Granted May 12, 2020·0 cites·14 claims
- 3233US2016225965A1Packaging structure of light emitting diodes and method thereforUNISTARS CORP·Filed 2015·Application pending·0 cites
- 3332US10121943B2Light emitting package base structureUNISTARS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 3432US2016190397A1Led package structure and the manufacturing method of the sameUNISTARS CORP·Filed 2015·Application pending·0 cites
- 3531US2017338388A1Ultraviolet light-emitting diode packaging structureUNISTARS CORP·Filed 2017·Application pending·0 cites
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