Inventor · disambiguated record
Hee-Seok Lee
Also filed as: LEE HEE-SEOK
54 granted patents·19 pending applications·371 citations·filing 2005–2023
98Inventor score
Top patents by PatentIndex Score
73 records- 0198US10262218B2Simultaneous object detection and rigid transform estimation using neural networkQUALCOMM INC·Filed 2017·Granted Apr 16, 2019·45 cites·21 claims
- 0297US8664751B2Semiconductor packageKIM YONG-HOON·Filed 2011·Granted Mar 4, 2014·34 cites·8 claims
- 0396US8872319B2Stacked package structure including insulating layer between two stacked packagesKIM YONG-HOON·Filed 2011·Granted Oct 28, 2014·32 cites·38 claims
- 0495US8587096B2Semiconductor device including shielding layer and fabrication method thereofKIM YONG-HOON·Filed 2011·Granted Nov 19, 2013·21 cites·29 claims
- 0594US11475678B2Lane marker detection and lane instance recognitionQUALCOMM INC·Filed 2020·Granted Oct 18, 2022·8 cites·30 claims
- 0694US7868462B2Semiconductor package including transformer or antennaSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 11, 2011·39 cites·4 claims
- 0792US9362235B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 7, 2016·12 cites·11 claims
- 0892US7826551B2Input and output driver circuits for differential signal transfer, and differential signal transfer apparatus and methodsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 2, 2010·41 cites·17 claims
- 0990US8873245B2Embedded chip-on-chip package and package-on-package comprising sameKIM YONG-HOON·Filed 2011·Granted Oct 28, 2014·10 cites·8 claims
- 1088US7327020B2Multi-chip package including at least one semiconductor device enclosed thereinSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 5, 2008·18 cites·6 claims
- 1187US9520387B2Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 13, 2016·8 cites·14 claims
- 1284US11244936B2Semiconductor device package and apparatus comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·3 cites·13 claims
- 1384US7372148B2Semiconductor chip having coolant path, semiconductor package and package cooling system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 13, 2008·12 cites·43 claims
- 1483US7489035B2Integrated circuit chip package having a ring-shaped silicon decoupling capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 10, 2009·12 cites·29 claims
- 1582US8502084B2Semiconductor package including power ball matrix and power ring having improved power integritySONG EUN SEOK·Filed 2010·Granted Aug 6, 2013·7 cites·26 claims
- 1680US11600080B2Lane marker detectionQUALCOMM INC·Filed 2021·Granted Mar 7, 2023·1 cites·28 claims
- 1780US7936232B2Substrate for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 3, 2011·5 cites·13 claims
- 1879US7330084B2Printed circuit board having a bond wire shield structure for a signal transmission lineSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·9 cites·32 claims
- 1978US11508122B2Bounding box estimation and object detectionQUALCOMM INC·Filed 2020·Granted Nov 22, 2022·1 cites·27 claims
- 2078US10607971B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 31, 2020·2 cites·23 claims
- 2178US7374969B2Semiconductor package with conductive molding compound and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 20, 2008·9 cites·39 claims
- 2277US12482184B2Bounding box estimation and object detectionQUALCOMM INC·Filed 2022·Granted Nov 25, 2025·0 cites·14 claims
- 2376US9171827B2Stack type semiconductor packageLEE JIN-HO·Filed 2014·Granted Oct 27, 2015·3 cites·15 claims
- 2476US8253228B2Package on package structureKIM YONG-HOON·Filed 2011·Granted Aug 28, 2012·4 cites·20 claims
- 2575US9145442B2Cyclic pentadepsipeptides and microorganism of Fusarium strain producing the sameUNIV CHUNG ANG IND·Filed 2014·Granted Sep 29, 2015·1 cites·6 claims
- 2674US9260485B2Cyclic pentadepsipeptide derivative and fusarium strain producing the sameUNIV CHUNG ANG IND·Filed 2015·Granted Feb 16, 2016·1 cites·4 claims
- 2772US8120024B2Semiconductor package having test pads on top and bottom substrate surfaces and method of testing sameSONG EUN-SEOK·Filed 2007·Granted Feb 21, 2012·3 cites·15 claims
- 2871US8466554B2Electronic device having interconnections, openings, and pads having greater width than the openingsPARK JI-YONG·Filed 2011·Granted Jun 18, 2013·3 cites·18 claims
- 2969US10325339B2Method and device for capturing image of traffic signQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·2 cites·30 claims
- 3067US7372139B2Semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 13, 2008·3 cites·12 claims
- 3166US7705433B2Semiconductor package preventing generation of static electricity thereinSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 27, 2010·3 cites·16 claims
- 3265US8647976B2Semiconductor package having test pads on top and bottom substrate surfaces and method of testing sameSONG EUN-SEOK·Filed 2012·Granted Feb 11, 2014·1 cites·8 claims
- 3365US8106425B2Interconnection substrate, semiconductor chip package including the same, and display system including the sameCHOI YUN-SEOK·Filed 2007·Granted Jan 31, 2012·3 cites·22 claims
- 3464US11410040B2Efficient dropout inference for bayesian deep learningQUALCOMM INC·Filed 2018·Granted Aug 9, 2022·1 cites·21 claims
- 3564US8445996B2Semiconductor packageKIM YONG-HOON·Filed 2009·Granted May 21, 2013·2 cites·13 claims
- 3663US12112552B2Lane marker recognitionQUALCOMM INC·Filed 2022·Granted Oct 8, 2024·0 cites·30 claims
- 3763US9557616B2Source driver, an image display assembly and an image display apparatusCHUNG YE-CHUNG·Filed 2011·Granted Jan 31, 2017·2 cites·15 claims
- 3863US8299597B2Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor packageCHOI YUN-SEOK·Filed 2009·Granted Oct 30, 2012·2 cites·23 claims
- 3962US9054067B2Semiconductor package with thermal dissipating member and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 4062US7663221B2Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 16, 2010·2 cites·22 claims
- 4162US7508680B2Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 24, 2009·2 cites·26 claims
- 4261US2024096102A1Freespace detection using machine learning for autonomous systems and applicationsNVIDIA CORP·Filed 2023·Application pending·0 cites
- 4361US2011269698A1Novel Cyclic Pentadepsipeptide Derivative and Fusarium Strain Producing The SameUNIV CHUNG ANG IND·Filed 2009·Application pending·0 cites
- 4460US8970042B2Circuit board, comprising a core insulation filmSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Mar 3, 2015·1 cites·18 claims
- 4560US7768103B2Tape distribution substrate having pattern for reducing EMISAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 3, 2010·1 cites·18 claims
- 4659US11171128B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·15 claims
- 4756US9667880B2Activating flash for capturing images with textQUALCOMM INC·Filed 2014·Granted May 30, 2017·0 cites·30 claims
- 4855US2024194568A1Substrate and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4950US8552521B2Semiconductor package to remove power noise using ground impedanceSONG EUN-SEOK·Filed 2009·Granted Oct 8, 2013·0 cites·21 claims
- 5050US7760044B2Substrate for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·0 cites·19 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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