Inventor · disambiguated record
Chung-I Chiang
Also filed as: CHIANG CHUNG-I
14 granted patents·22 pending applications·87 citations·filing 1997–2015
90Inventor score
Files withWALSIN LIHWA CORP10CHIANG CHUNG-I5RITEK CORP4NSMC HOLDINGS INTERNAT CORP LT3ALLIANCE FIBER OPTICS PROD INC2
Top patents by PatentIndex Score
36 records- 0174US8217329B2Microminiaturized projection module having an image processing unit for transforming each of image signals into a modulating signal and a direction signal for projecting image onto objectCHIANG CHUNG-I·Filed 2010·Granted Jul 10, 2012·3 cites·21 claims
- 0274US7120317B1Method and system for a programmable image transformationSILICON MOTION INC·Filed 2001·Granted Oct 10, 2006·25 cites·28 claims
- 0373US8455910B2Method of manufacturing light emitting diode packaging lens and light emitting diode packageCHIANG CHUNG-I·Filed 2009·Granted Jun 4, 2013·6 cites·7 claims
- 0469US6823761B2Device for stripping coated optical fiber ribbonsALLIANCE FIBER OPTICS PROD INC·Filed 2003·Granted Nov 30, 2004·15 cites·8 claims
- 0568US8643273B2Light emitting diode device having pillars disposed such that light efficiency of the device is improvedCHIANG CHUNG-I·Filed 2012·Granted Feb 4, 2014·1 cites·3 claims
- 0667US8632237B2Light guide plate with adjustable illumination angle, illumination device with adjustable illumination angle, and method for adjusting illumination angle thereofCHIANG CHUNG-I·Filed 2012·Granted Jan 21, 2014·2 cites·19 claims
- 0764US9672426B2Intelligent monitoring systemCHALLENTECH INT CORP·Filed 2014·Granted Jun 6, 2017·2 cites·9 claims
- 0857US7481558B2Lateral light emitting apparatusBRIGHT VIEW ELECTRONICS CO LTD·Filed 2007·Granted Jan 27, 2009·3 cites·19 claims
- 0956US2014103382A1High efficiency light emitting diode deviceWALSIN LIHWA CORP·Filed 2013·Application pending·0 cites
- 1054US8513886B1Light emitting diode deviceWALSIN LIHWA CORP·Filed 2013·Granted Aug 20, 2013·0 cites·18 claims
- 1151US5992032AMethod and apparatus for inclination measurement using piezoelectric effectCHUNG SHAN INST OF SCIENCE·Filed 1997·Granted Nov 30, 1999·20 cites·6 claims
- 1250US6782183B2Method and apparatus for fiber array moduleALLIANCE FIBER OPTICS PROD INC·Filed 2003·Granted Aug 24, 2004·4 cites·15 claims
- 1349US2011080108A1Color tunable light emitting diodeWALSIN LIHWA CORP·Filed 2009·Application pending·0 cites
- 1447US2013233710A1Method of manufacturing light emitting diode packaging lens and light emmiting diode packageWALSIN LIHWA CORP·Filed 2013·Application pending·0 cites
- 1547US2013313965A1Light Emitting Diode UnitWALSIN LIHWA CORP·Filed 2013·Application pending·0 cites
- 1646US2006103757A1Iris apparatus and operating method thereofNSMC HOLDINGS INTERNAT CORP LT·Filed 2004·Application pending·0 cites
- 1746US2006103953A1Electrical micro-optic module with improved joint structuresNSMC HOLDINGS INTERNAT CORP LT·Filed 2004·Application pending·0 cites
- 1846US2006108518A1Structure for calibrating packaging of electric micro-optic modulesNSMC HOLDINGS INTERNAT CORP LT·Filed 2004·Application pending·0 cites
- 1943US2013026524A1Light emitting diodeWALSIN LIHWA CORP·Filed 2012·Application pending·0 cites
- 2042US2014063836A1Laser Lighting DeviceWALSIN LIHWA CORP·Filed 2013·Application pending·0 cites
- 2142US2004134786A1Mold for a V-groove fiber array base block and fabrication method thereofRITEK CORP·Filed 2003·Application pending·0 cites
- 2240US2011221663A1Edge type backlighting moduleWALSIN LIHWA CORP·Filed 2010·Application pending·0 cites
- 2339US2011163679A1Ac light emitting diode device having integrated passive deviceWALSIN LIHWA CORP·Filed 2010·Application pending·0 cites
- 2437US9299862B2Device packaging method and device package structureCHALLENTECH INTERNAT CORP·Filed 2014·Granted Mar 29, 2016·0 cites·13 claims
- 2537US2013169164A1Device and method for protecting eyesSHEN HUNG-HSIANG·Filed 2012·Application pending·0 cites
- 2637US2015213209A1Care Service Transaction Method and System ThereofCHALLENTECH INTERNAT CORP·Filed 2014·Application pending·0 cites
- 2736US2013122610A1Apparatus and Method for Die BondingCHUNG JUN-WEI·Filed 2012·Application pending·0 cites
- 2836US2012318850A1Chip bonding apparatusLOU WEI-CHENG·Filed 2011·Application pending·0 cites
- 2936US2011198619A1Light emitting diode assembly having improved lighting efficiencyWALSIN LIHWA CORP·Filed 2010·Application pending·0 cites
- 3036US2012327661A1Alignment structure, laser lighting source module and optical alignment methodCHIANG CHUNG-I·Filed 2011·Application pending·0 cites
- 3135US2003194197A1Fiber array module and method for fabricating the sameRITEK CORP·Filed 2003·Application pending·0 cites
- 3235US2013105852A1Package structure and manufacturing method for the sameLOU WEI-CHENG·Filed 2012·Application pending·0 cites
- 3335US2003194196A1Fiber array base block for fiber array module and method for fixing optical fibers to the fiber array base blockRITEK CORP·Filed 2003·Application pending·0 cites
- 3435US2003194494A1Method for forming soldering layer of fiber arraysRITEK CORP·Filed 2003·Application pending·0 cites
- 3532US9406860B2Wafer level package structure for temperature sensing elementsCHALLENTECH INT CORP·Filed 2015·Granted Aug 2, 2016·0 cites·10 claims
- 3632US6073355AMethod for inclination measurement using piezoelectric effectCHUNG SHAN INST OF SCIENCE·Filed 1999·Granted Jun 13, 2000·6 cites·2 claims
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