Inventor · disambiguated record
Richard Redburn
Also filed as: REDBURN RICHARD
3 granted patents·42 citations·filing 2008–2012
72Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0190US7973418B2Solder bump interconnect for improved mechanical and thermo-mechanical performanceFLIPCHIP INT LLC·Filed 2008·Granted Jul 5, 2011·27 cites·20 claims
- 0287US8188606B2Solder bump interconnectALVARADO REYNANTE·Filed 2011·Granted May 29, 2012·12 cites·20 claims
- 0371US8446019B2Solder bump interconnectALVARADO REYNANTE·Filed 2012·Granted May 21, 2013·3 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →