Inventor · disambiguated record
Pei-Haw Tsao
Also filed as: TSAO PEI · TSAO PEI-HAW
110 granted patents·39 pending applications·2,156 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD53TAIWAN SEMICONDUCTOR MFG46HON HAI PREC IND CO LTD19MEDIATEK INC9TSAO PEI-HAW5
Top patents by PatentIndex Score
149 records- 0198US7932601B2Enhanced copper posts for wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Apr 26, 2011·59 cites·20 claims
- 0298US7559805B1Electrical connector with power contactsHON HAI PREC IND CO LTD·Filed 2008·Granted Jul 14, 2009·95 cites·11 claims
- 0398US7467977B1Electrical connector with additional mating portHON HAI PREC IND CO LTD·Filed 2008·Granted Dec 23, 2008·86 cites·12 claims
- 0497US7717733B1Cable assembly having enhanced interconnection device thereofHON HAI PREC IND CO LTD·Filed 2008·Granted May 18, 2010·79 cites·20 claims
- 0597US6489563B1Electrical cable with grounding sleeveHON HAI PREC IND CO LTD·Filed 2001·Granted Dec 3, 2002·125 cites·8 claims
- 0696US9525227B2Flippable electrical connectorHON HAI PREC IND CO LTD·Filed 2014·Granted Dec 20, 2016·37 cites·14 claims
- 0796US7896559B2Cable assembly having floatable terminationHON HAI PREC IND CO LTD·Filed 2008·Granted Mar 1, 2011·56 cites·20 claims
- 0896US6656827B1Electrical performance enhanced wafer level chip scale package with groundTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 2, 2003·142 cites·20 claims
- 0996US6444902B1Electrical cableHON HAI PREC IND CO LTD·Filed 2001·Granted Sep 3, 2002·97 cites·6 claims
- 1095US7719122B2System-in-package packaging for minimizing bond wire contamination and yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 18, 2010·72 cites·6 claims
- 1195US7534143B1Electrical connector with improved wire termination arrangementHON HAI PREC IND CO LTD·Filed 2007·Granted May 19, 2009·60 cites·20 claims
- 1294US7294937B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 13, 2007·26 cites·30 claims
- 1394US6770958B2Under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 3, 2004·80 cites·4 claims
- 1494US6630624B2Electrical cable with grounding meansHON HAI PREC IND CO LTD·Filed 2001·Granted Oct 7, 2003·76 cites·2 claims
- 1593US6787926B2Wire stitch bond on an integrated circuit bond pad and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 7, 2004·85 cites·24 claims
- 1693US6607942B1Method of fabricating as grooved heat spreader for stress reduction in an IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 19, 2003·75 cites·12 claims
- 1792US10892230B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 12, 2021·6 cites·20 claims
- 1892US10283424B1Wafer structure and packaging methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 7, 2019·10 cites·20 claims
- 1992US10163827B1Package structure with protrusion structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·7 cites·20 claims
- 2092US7112522B1Method to increase bump height and achieve robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 26, 2006·25 cites·15 claims
- 2192US6939789B2Method of wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 6, 2005·84 cites·28 claims
- 2291US11404383B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 2391US7820543B2Enhanced copper posts for wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Oct 26, 2010·18 cites·10 claims
- 2491US7659632B2Solder bump structure and method of manufacturing sameTAIWAN SEMINCONDUCTOR MFG CO L·Filed 2006·Granted Feb 9, 2010·30 cites·20 claims
- 2591US6288451B1Flip-chip package utilizing a printed circuit board having a roughened surface for increasing bond strengthVANGUARD INT SEMICONDUCT CORP·Filed 1998·Granted Sep 11, 2001·126 cites·17 claims
- 2690US10510633B1Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 2790US7497724B1Cable connector assembly with improved wire organizerHON HAI PREC IND CO LTD·Filed 2007·Granted Mar 3, 2009·56 cites·16 claims
- 2890US7435132B1Cable connector assembly with improved grounding memberHON HAI PREC IND CO LTD·Filed 2007·Granted Oct 14, 2008·43 cites·3 claims
- 2989US10373901B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·5 cites·20 claims
- 3089US7397127B2Bonding and probing pad structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 8, 2008·19 cites·17 claims
- 3189US6596619B1Method for fabricating an under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 22, 2003·48 cites·11 claims
- 3288US7583502B2Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)TAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 1, 2009·17 cites·17 claims
- 3388US7157734B2Semiconductor bond pad structures and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 2, 2007·23 cites·20 claims
- 3488US6782897B2Method of protecting a passivation layer during solder bump formationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·52 cites·18 claims
- 3587US10867881B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 3687US7190066B2Heat spreader and package structure utilizing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 13, 2007·14 cites·15 claims
- 3786US10304793B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 28, 2019·5 cites·20 claims
- 3886US9780046B2Seal rings structures in semiconductor device interconnect layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·5 cites·20 claims
- 3985US10506712B1Printed circuit boardTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·3 cites·19 claims
- 4085US7446398B2Bump pattern design for flip chip semiconductor packageTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 4, 2008·15 cites·18 claims
- 4185US7126225B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 24, 2006·29 cites·14 claims
- 4284US9454684B2Edge crack detection systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·6 cites·16 claims
- 4384US8492263B2Protected solder ball joints in wafer level chip-scale packagingWANG CHUNG YU·Filed 2007·Granted Jul 23, 2013·11 cites·13 claims
- 4484US2025323200A1Chip structure with conductive bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4583US12417993B2Chip structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 4682US10679877B2Carrier tape system and methods of using carrier tape systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 9, 2020·2 cites·20 claims
- 4782US7654871B2Electrical connector with additional mating portHON HAI PREC IND CO LTD·Filed 2009·Granted Feb 2, 2010·17 cites·15 claims
- 4881US9136211B2Protected solder ball joints in wafer level chip-scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·5 cites·19 claims
- 4981US2025364521A1Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5080US12205859B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
Showing the top 50 of 149 patent records by PatentIndex Score.
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