Inventor · disambiguated record

Tae-Seog Kim

Also filed as: KIM TAE-SEOG

1 granted patent·21 citations·filing 2005–2005

40Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG1

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1 record

0185US7439098B2Semiconductor package for encapsulating multiple dies and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 21, 2008·21 cites·20 claims

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