Inventor · disambiguated record

Weng Shyan Aik

Also filed as: AIK WENG SHYAN

1 granted patent·4 citations·filing 2009–2009

25Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG1

Top patents by PatentIndex Score

1 record

0159US7982293B2Multi-chip package including die paddle with stepsINFINEON TECHNOLOGIES AG·Filed 2009·Granted Jul 19, 2011·4 cites·20 claims

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