Inventor · disambiguated record

Thanawat Jaengkrajarng

Also filed as: JAENGKRAJARNG THANAWAT

3 granted patents·2 citations·filing 2019–2021

52Inventor score

Technology areasH10W

Files withUTAC HEADQUARTERS PTE LTD3

Top patents by PatentIndex Score

3 records

0170US11145575B2Conductive bonding layer with spacers between a package substrate and chipUTAC HEADQUARTERS PTE LTD·Filed 2019·Granted Oct 12, 2021·2 cites·14 claims
0256US11710681B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
0349US11804416B2Semiconductor device and method of forming protective layer around cavity of semiconductor dieUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →