Inventor · disambiguated record

Alexander Lucero Laylo

Also filed as: LAYLO ALEXANDER LUCERO

2 granted patents·2 citations·filing 2019–2021

39Inventor score

Technology areasH10W

Files withUTAC HEADQUARTERS PTE LTD2

Top patents by PatentIndex Score

2 records

0170US11145575B2Conductive bonding layer with spacers between a package substrate and chipUTAC HEADQUARTERS PTE LTD·Filed 2019·Granted Oct 12, 2021·2 cites·14 claims
0256US11710681B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →