Inventor · disambiguated record
Stefan Woetzel
Also filed as: WOETZEL STEFAN
6 granted patents·2 citations·filing 2020–2022
67Inventor score
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0186US11676879B2Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrierINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·2 cites·19 claims
- 0265US12412797B2Hybrid embedded packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 9, 2025·0 cites·8 claims
- 0357US11521907B2Hybrid embedded packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 6, 2022·0 cites·10 claims
- 0454US11984392B2Semiconductor package having a chip carrier with a pad offset featureINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 0553US12283538B2Molded semiconductor package having an embedded inlayINFINEON TECHNOLOGIES AG·Filed 2022·Granted Apr 22, 2025·0 cites·17 claims
- 0652US11710684B2Package with separate substrate sectionsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 25, 2023·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →