Inventor · disambiguated record

Taek-Hoon Lee

Also filed as: LEE TAEK-HOON

1 granted patent·0 citations·filing 2008–2008

10Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0143US7898075B2Semiconductor package having resin substrate with recess and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·0 cites·19 claims

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