Inventor · disambiguated record
Keiji Yoshizawa
Also filed as: YOSHIZAWA KEIJI
9 granted patents·141 citations·filing 1995–2016
86Inventor score
Top patents by PatentIndex Score
9 records- 0189US5601905ALaminate for insulation protection of circuit boardsNIPPON STEEL CHEMICAL CO·Filed 1995·Granted Feb 11, 1997·84 cites·9 claims
- 0280US6492616B1Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boardsNIPPON STEEL CHEMICAL CO·Filed 2000·Granted Dec 10, 2002·40 cites·8 claims
- 0375US9681546B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 13, 2017·5 cites·7 claims
- 0471US9899304B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Feb 20, 2018·2 cites·12 claims
- 0566US7495745B2Patterning method and computer readable medium thereforSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 24, 2009·2 cites·10 claims
- 0651US6577991B1Recordable method of processing figureSHINKO ELECTRIC IND CO·Filed 2000·Granted Jun 10, 2003·5 cites·6 claims
- 0747US6957176B2Reduction processing method and computer readable storage medium having program stored thereon for causing computer to execute the methodSHINKO ELECTRIC IND CO·Filed 2001·Granted Oct 18, 2005·3 cites·12 claims
- 0840US7099806B2Sizing processing system and computer program for the sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Aug 29, 2006·0 cites·6 claims
- 0936US7085417B2Method of efficiently converting-to-array and compressing data in a process for converting mask patterns of a LSISHINKO ELECTRIC IND CO·Filed 2002·Granted Aug 1, 2006·0 cites·7 claims
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