Inventor · disambiguated record
Pyoung-Wan Kim
Also filed as: KIM PYOUNG-WAN
16 granted patents·8 pending applications·222 citations·filing 2002–2024
93Inventor score
Top patents by PatentIndex Score
24 records- 0197US7807512B2Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 5, 2010·115 cites·20 claims
- 0286US8373261B2Chip stack package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Feb 12, 2013·9 cites·15 claims
- 0380US9793309B2Image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 17, 2017·5 cites·18 claims
- 0480US8093703B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2008·Granted Jan 10, 2012·10 cites·46 claims
- 0580US7521810B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 21, 2009·9 cites·14 claims
- 0677US7626254B2Semiconductor package using chip-embedded interposer substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 1, 2009·9 cites·8 claims
- 0771US7148080B2Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·19 cites·45 claims
- 0871US6498389B1Ultra-thin semiconductor package device using a support tapeSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 24, 2002·18 cites·16 claims
- 0969US8008771B2Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·4 cites·19 claims
- 1069US6946328B2Method for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 20, 2005·17 cites·20 claims
- 1165US10105102B2Package for processing sensed-data, sensed-data processor, and system for processing sensed-dataSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 23, 2018·1 cites·10 claims
- 1261US8344497B2Semiconductor package and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 1, 2013·2 cites·12 claims
- 1360US7498679B2Package substrate and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 3, 2009·4 cites·6 claims
- 1460US2025105158A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1552US2009298234A1Method of fabricating semiconductor chip package, semiconductor wafer, and method of sawing the semiconductor waferLEE TEAK-HOON·Filed 2009·Application pending·0 cites
- 1647US8846446B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2011·Granted Sep 30, 2014·0 cites·10 claims
- 1747US8154122B2Semiconductor package and methods of manufacturing the semiconductor packageJANG CHUL-YONG·Filed 2009·Granted Apr 10, 2012·0 cites·11 claims
- 1847US2010081236A1Method of manufacturing semiconductor device with embedded interposerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1947US2010013076A1Semiconductor device package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2046US2009134528A1Semiconductor package, electronic device including the semiconductor package, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2143US7898075B2Semiconductor package having resin substrate with recess and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·0 cites·19 claims
- 2243US2008265432A1Multi-chip package and method of manufacturing the multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2341US2007001284A1Semiconductor package having lead free conductive bumps and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2438US2013193545A1Semiconductor apparatus and image sensor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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