Inventor · disambiguated record
Chul-Yong Jang
Also filed as: JANG CHUL-YONG
17 granted patents·8 pending applications·170 citations·filing 2007–2025
92Inventor score
Top patents by PatentIndex Score
25 records- 0197US7807512B2Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 5, 2010·115 cites·20 claims
- 0295US9640513B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 2, 2017·15 cites·14 claims
- 0388US8970046B2Semiconductor packages and methods of forming the sameKIM YOUNG LYONG·Filed 2012·Granted Mar 3, 2015·10 cites·20 claims
- 0487US12406895B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·2 cites·20 claims
- 0580US9281235B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 8, 2016·3 cites·15 claims
- 0680US8093703B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2008·Granted Jan 10, 2012·10 cites·46 claims
- 0776US9627327B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 18, 2017·2 cites·13 claims
- 0873US2025364347A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0969US8008771B2Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·4 cites·19 claims
- 1068US9159705B2Semiconductor chip connecting semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 13, 2015·2 cites·19 claims
- 1166US9245816B2Semiconductor package and method of manufacturing the semiconductor packageJANG CHUL-YONG·Filed 2014·Granted Jan 26, 2016·2 cites·15 claims
- 1265US9570423B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 14, 2017·1 cites·18 claims
- 1361US8344497B2Semiconductor package and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 1, 2013·2 cites·12 claims
- 1460US7759795B2Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·2 cites·15 claims
- 1550US9364914B2Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ballSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 14, 2016·0 cites·10 claims
- 1647US8846446B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2011·Granted Sep 30, 2014·0 cites·10 claims
- 1747US8154122B2Semiconductor package and methods of manufacturing the semiconductor packageJANG CHUL-YONG·Filed 2009·Granted Apr 10, 2012·0 cites·11 claims
- 1847US2010081236A1Method of manufacturing semiconductor device with embedded interposerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1947US2010013076A1Semiconductor device package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2047US2008290514A1Semiconductor device package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2146US2022246582A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 2246US2009134528A1Semiconductor package, electronic device including the semiconductor package, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2346US2010096754A1Semiconductor package, semiconductor module, and method for fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2443US7898075B2Semiconductor package having resin substrate with recess and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·0 cites·19 claims
- 2541US2013161784A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →