Inventor · disambiguated record
Cheal-Sang Yoon
Also filed as: YOON CHEAL-SANG
1 granted patent·2 pending applications·9 citations·filing 2007–2008
31Inventor score
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3 records- 0169US8042593B2Semiconductor chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 25, 2011·9 cites·18 claims
- 0237US2009035105A1Apparatus for separating chip, a method for fabricating the apparatus, and a method for separating a chipSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0329US2008000587A1Bonding apparatus of semiconductor packageHA YONG-DAE·Filed 2007·Application pending·0 cites
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