Inventor · disambiguated record
Chih-Chien Liu
Also filed as: LIU CHIH-CHIEN
115 granted patents·37 pending applications·1,605 citations·filing 1997–2021
99Inventor score
Files withUNITED MICROELECTRONICS CORP95LIU CHIH-CHIEN10CHIEN CHIN-CHENG6CHEN JEI-MING3COMPAL ELECTRONICS INC3
Top patents by PatentIndex Score
152 records- 0197US6203863B1Method of gap fillingUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 20, 2001·318 cites·20 claims
- 0296US8441072B2Non-planar semiconductor structure and fabrication method thereofTSAI SHIH-HUNG·Filed 2011·Granted May 14, 2013·27 cites·19 claims
- 0396US5968610AMulti-step high density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Oct 19, 1999·371 cites·22 claims
- 0495US10269868B1Semiconductor structure and the method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 23, 2019·12 cites·12 claims
- 0595US8709901B1Method of forming an isolation structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 29, 2014·26 cites·16 claims
- 0695US8062536B2High density plasma chemical vapor deposition processLIU CHIH-CHIEN·Filed 2010·Granted Nov 22, 2011·20 cites·12 claims
- 0794US10177311B1Resistive random access memory (RRAM) and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·11 cites·20 claims
- 0893US10283564B1Semiconductor structure and the method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 7, 2019·8 cites·18 claims
- 0991US8772904B2Semiconductor structure and process thereofLIU CHIH-CHIEN·Filed 2012·Granted Jul 8, 2014·12 cites·6 claims
- 1091US6323123B1Low-K dual damascene integration processUNITED MICROELECTRONICS CORP·Filed 2000·Granted Nov 27, 2001·71 cites·19 claims
- 1190US9263257B2Semiconductor device having fin-shaped structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 16, 2016·8 cites·9 claims
- 1289US8551829B2Method for manufacturing multi-gate transistor deviceCHIEN CHIN-CHENG·Filed 2010·Granted Oct 8, 2013·11 cites·18 claims
- 1389US8324118B2Manufacturing method of metal gate structureLIU CHIH-CHIEN·Filed 2011·Granted Dec 4, 2012·11 cites·10 claims
- 1488US11340662B2Portable electronic device and disinfecting and sterilizing method thereofLIN YI CHUN·Filed 2021·Granted May 24, 2022·2 cites·27 claims
- 1588US9362358B2Spatial semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 7, 2016·6 cites·5 claims
- 1688US8951884B1Method for forming a FinFET structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 10, 2015·7 cites·11 claims
- 1787US8937369B2Transistor with non-uniform stress layer with stress concentrated regionsUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jan 20, 2015·7 cites·21 claims
- 1886US10770464B2Semiconductor device including bit line structure of dynamic random access memory (DRAM) and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 8, 2020·5 cites·6 claims
- 1986US6410446B1Method for gap fillingUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jun 25, 2002·29 cites·10 claims
- 2085US10332888B2Memory devices and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·4 cites·18 claims
- 2185US8609529B2Fabrication method and structure of through silicon viaLIN CHIN-FU·Filed 2012·Granted Dec 17, 2013·7 cites·12 claims
- 2285US8497198B2Semiconductor processCHIEN CHIN-CHENG·Filed 2011·Granted Jul 30, 2013·8 cites·18 claims
- 2384US7271101B2High density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 18, 2007·6 cites·32 claims
- 2482US9263282B2Method of fabricating semiconductor patternsUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 16, 2016·5 cites·13 claims
- 2582US9184100B2Semiconductor device having strained fin structure and method of making the sameTSAI TENG-CHUN·Filed 2011·Granted Nov 10, 2015·6 cites·9 claims
- 2682US6873057B2Damascene interconnect with bi-layer capping filmUNITED MICROELECTRTONICS CORP·Filed 2003·Granted Mar 29, 2005·38 cites·4 claims
- 2782US6117345AHigh density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Sep 12, 2000·44 cites·21 claims
- 2881US8822284B2Method for fabricating FinFETs and semiconductor structure fabricated using the methodLIN CHIN-FU·Filed 2012·Granted Sep 2, 2014·4 cites·13 claims
- 2980US9159831B2Multigate field effect transistor and process thereofUNITED MICROELECTRONICS CORP·Filed 2012·Granted Oct 13, 2015·4 cites·7 claims
- 3079US9384996B2Method for manufacturing semiconductor device and device manufactured by the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 5, 2016·4 cites·21 claims
- 3179US8954805B2Computer booting method and computer systemLIU CHIH-CHIEN·Filed 2012·Granted Feb 10, 2015·9 cites·14 claims
- 3279US8927388B2Method of fabricating dielectric layer and shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jan 6, 2015·4 cites·19 claims
- 3378US7576455B2High performance focusing actuator of a voice coil motorTRICORE CORP·Filed 2006·Granted Aug 18, 2009·11 cites·8 claims
- 3478US6750129B2Process for forming fusible linksINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 15, 2004·27 cites·27 claims
- 3577US7557043B2Method of fabricating the stacked structure and damascene processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 7, 2009·6 cites·16 claims
- 3676US8361854B2Fin field-effect transistor structure and manufacturing process thereofUNITED MICROELECTRONICS CORP·Filed 2011·Granted Jan 29, 2013·3 cites·12 claims
- 3775US9559189B2Non-planar FETCHIEN CHIN-CHENG·Filed 2012·Granted Jan 31, 2017·3 cites·7 claims
- 3875US9184292B2Semiconductor structure with different fins of FinFETsUNITED MICROELECTRONICS CORP·Filed 2014·Granted Nov 10, 2015·2 cites·20 claims
- 3973US7439154B2Method of fabricating interconnect structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Oct 21, 2008·6 cites·9 claims
- 4073US6440861B1Method of forming dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 27, 2002·21 cites·15 claims
- 4172US10374051B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 6, 2019·1 cites·11 claims
- 4272US6905938B2Method of forming interconnect structure with low dielectric constantUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jun 14, 2005·17 cites·17 claims
- 4372US6319814B1Method of fabricating dual damasceneUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 20, 2001·38 cites·14 claims
- 4471US8822336B2Through-silicon via forming methodTSAI TENG-CHUN·Filed 2011·Granted Sep 2, 2014·3 cites·8 claims
- 4571US6239018B1Method for forming dielectric layersUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·29 cites·6 claims
- 4669US10089457B2Unlocking device to access uncertified networksCOMPAL ELECTRONICS INC·Filed 2016·Granted Oct 2, 2018·2 cites·19 claims
- 4769US6339025B1Method of fabricating a copper capping layerUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 15, 2002·33 cites·24 claims
- 4869US6197681B1Forming copper interconnects in dielectric materials with low constant dielectricsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 6, 2001·38 cites·17 claims
- 4967US9318567B2Fabrication method for semiconductor devicesCHIEN CHIN-CHENG·Filed 2012·Granted Apr 19, 2016·2 cites·20 claims
- 5067US6638878B2Film planarization for low-k polymers used in semiconductor structuresIBM·Filed 2001·Granted Oct 28, 2003·10 cites·18 claims
Showing the top 50 of 152 patent records by PatentIndex Score.
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