Inventor · disambiguated record
Ashish Alawani
Also filed as: ALAWANI ASHISH · ALAWANI ASHISH D
7 granted patents·7 pending applications·24 citations·filing 2003–2023
78Inventor score
Top patents by PatentIndex Score
14 records- 0190US8946904B2Substrate vias for heat removal from semiconductor dieRAILKAR TARAK A·Filed 2010·Granted Feb 3, 2015·16 cites·27 claims
- 0280US10134682B2Circuit package with segmented external shield to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Nov 20, 2018·4 cites·15 claims
- 0370US10141268B2Circuit package with internal and external shieldingAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Nov 27, 2018·2 cites·20 claims
- 0460US9997428B2Via structures for thermal dissipationAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Jun 12, 2018·1 cites·40 claims
- 0560US9865479B2Method of attaching components to printed cirucuit board with reduced accumulated tolerancesAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jan 9, 2018·1 cites·20 claims
- 0655US2025192099A1Integrated circuit(ic) package having a substrate employing reduced area, added metal pad(s) to metal interconnect(s) to reduce die-substrate clearanceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0740US2005011672A1Overmolded MCM with increased surface mount component reliabilityFiled 2003·Application pending·0 cites
- 0839US11626336B2Package comprising a solder resist layer configured as a seating plane for a deviceQUALCOMM INC·Filed 2019·Granted Apr 11, 2023·0 cites·28 claims
- 0938US2007257375A1Increased interconnect density electronic package and method of fabricationROLAND JAMES P·Filed 2006·Application pending·0 cites
- 1036US10021790B2Module with internal wire fence shieldingAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jul 10, 2018·0 cites·13 claims
- 1133US2017117229A1Circuit package with trench features to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 1232US2017018501A1Via structures for thermal dissipationAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 1332US2017118877A1Circuit package with bond wires to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 1432US2017223839A1Printed circuit board with compartmental shields for electronic components and methods of fabricating the sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →