Inventor · disambiguated record

Keiji Takamura

Also filed as: TAKAMURA KEIJI

1 granted patent·0 citations·filing 2003–2003

11Inventor score

Technology areasH10W

Files withNEC CORP1

Top patents by PatentIndex Score

1 record

0126US6962281B2Bonding apparatus and bonding method having process for judging bonding stateNEC CORP·Filed 2003·Granted Nov 8, 2005·0 cites·8 claims

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