Inventor · disambiguated record
Mehrdad Mahanpour
Also filed as: MAHANPOUR MEHRDAD
23 granted patents·2 pending applications·263 citations·filing 1997–2004
95Inventor score
Files withADVANCED MICRO DEVICES INC23
Top patents by PatentIndex Score
25 records- 0191US6528332B2Method and system for reducing polymer build up during plasma etch of an intermetal dielectricADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 4, 2003·72 cites·6 claims
- 0286US6830941B1Method and apparatus for identifying individual die during failure analysisADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 14, 2004·44 cites·3 claims
- 0381US6452234B1How to improve the ESD on SOI devicesADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 17, 2002·31 cites·6 claims
- 0463US6866416B1Detecting heat generating failures in unpassivated semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2003·Granted Mar 15, 2005·6 cites·10 claims
- 0562US6395129B1Process to decapsulate a FBGA packageADVANCED MICRO DEVICES INC·Filed 2000·Granted May 28, 2002·14 cites·14 claims
- 0661US7670915B1Contact liner in integrated circuit technologyADVANCED MICRO DEVICES INC·Filed 2004·Granted Mar 2, 2010·9 cites·20 claims
- 0760US6320400B1Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a shortADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 20, 2001·23 cites·4 claims
- 0858US6995564B1Method and system for locating chip-level defects through emission imaging of a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2003·Granted Feb 7, 2006·10 cites·7 claims
- 0952US7093209B2Method and apparatus for packaging test integrated circuitsADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 15, 2006·5 cites·6 claims
- 1052US6309899B1Method and system for removing a die from a semiconductor packageADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 30, 2001·4 cites·11 claims
- 1145US6770512B1Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sectionsADVANCED MICRO DEVICES INC·Filed 2002·Granted Aug 3, 2004·4 cites·5 claims
- 1244US6770495B1Method for revealing active regions in a SOI structure for DUT backside inspectionADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 3, 2004·2 cites·11 claims
- 1342US6181153B1Method and system for detecting faults in a flip-chip packageADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 30, 2001·9 cites·12 claims
- 1438US6030282AMethod and apparatus for holding, grinding and polishing a packaged semiconductor dieADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 29, 2000·7 cites·10 claims
- 1538US2005048731A1Siliciding spacer in integrated circuit technologyFiled 2003·Application pending·0 cites
- 1636US6991946B1Method and system for providing backside voltage contrast for silicon on insulator devicesADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 31, 2006·2 cites·8 claims
- 1735US6941529B1Method and system for using emission microscopy in physical verification of memory device architectureADVANCED MICRO DEVICES INC·Filed 2002·Granted Sep 6, 2005·1 cites·14 claims
- 1834US6304792B1Separation of a multi-layer integrated circuit device and packageADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 16, 2001·4 cites·18 claims
- 1934US2002089066A1Method and system for decapsulating a multi-chip packageFiled 2001·Application pending·0 cites
- 2032US6127194APackage removal for FBGA devicesADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 3, 2000·3 cites·9 claims
- 2131US6485361B1Apparatus for holding and delayering a semiconductor dieADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 26, 2002·2 cites·7 claims
- 2231US6076686ASupport structure for use during package removal from a multi-layer integrated circuit deviceADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 20, 2000·5 cites·13 claims
- 2330US6387206B1Method and system for plastic package decapsulation of electronic devicesADVANCED MICRO DEVICES INC·Filed 1999·Granted May 14, 2002·3 cites·7 claims
- 2430US6227941B1Support structure with multi-layer support material for use during package removal from a multi-layer integrated circuit deviceADVANCED MICRO DEVICES INC·Filed 1998·Granted May 8, 2001·1 cites·15 claims
- 2529US6253353B1Method and system for providing a library for identifying VCC to ground shorts in a circuit in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1999·Granted Jun 26, 2001·2 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →