Inventor · disambiguated record
Hsien-Ming Tu
Also filed as: TU HSIEN-MING
35 granted patents·1 pending application·85 citations·filing 2013–2025
96Inventor score
Technology areasH10W
Top patents by PatentIndex Score
36 records- 0196US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
- 0296US9627332B1Integrated circuit structure and seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·22 cites·20 claims
- 0390US10497646B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·5 cites·20 claims
- 0485US9947630B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 0585US9048149B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·6 cites·20 claims
- 0684US12261126B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 25, 2025·0 cites·20 claims
- 0784US2025323148A1Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0882US12322696B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0982US12278199B2Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1082US10354986B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·2 cites·20 claims
- 1182US9559044B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·20 claims
- 1281US10985121B2Bump structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·2 cites·20 claims
- 1381US9786618B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 1481US9461106B1MIM capacitor and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·4 cites·20 claims
- 1578US9852985B1Conductive terminal on integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·3 cites·20 claims
- 1678US9799615B1Package structures having height-adjusted molding members and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·3 cites·19 claims
- 1777US10269737B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 1875US10262958B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 16, 2019·1 cites·20 claims
- 1973US11837562B2Conductive bump of a semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 2073US11469200B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 2173US11107772B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
- 2273US10163828B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·2 cites·14 claims
- 2373US9484318B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·2 cites·19 claims
- 2472US11923318B2Method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 2564US11735518B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 22, 2023·0 cites·20 claims
- 2664US10825804B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 2762US10879198B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 2860US10854564B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 2958US9812434B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 7, 2017·0 cites·20 claims
- 3057US9343417B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·0 cites·21 claims
- 3156US10032737B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
- 3256US9679883B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 3349US9318456B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 19, 2016·0 cites·19 claims
- 3441US10062654B2Semicondcutor structure and semiconductor manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·0 cites·14 claims
- 3541US9943239B2Optical sensing system and associated electronic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·20 claims
- 3640US9748212B2Shadow pad for post-passivation interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →