Inventor · disambiguated record

Hsien-Ming Dai

Also filed as: DAI HSIEN-MING

1 granted patent·3 citations·filing 2008–2008

21Inventor score

Technology areasH05K

Files withKINSUS INTERCONNECT TECH CORP1

Top patents by PatentIndex Score

1 record

0161US7805835B2Method for selectively processing surface tension of solder mask layer in circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2008·Granted Oct 5, 2010·3 cites·2 claims

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