Inventor · disambiguated record
Toshio Hamano
Also filed as: HAMANO TOSHIO
29 granted patents·3 pending applications·1,166 citations·filing 1984–2011
98Inventor score
Top patents by PatentIndex Score
32 records- 0194US6433418B1Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanismFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·178 cites·4 claims
- 0294US6348728B1Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layerFUJITSU LTD·Filed 2000·Granted Feb 19, 2002·91 cites·9 claims
- 0387US6347037B2Semiconductor device and method of forming the sameFUJITSU LTD·Filed 1998·Granted Feb 12, 2002·99 cites·14 claims
- 0487US6288444B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Sep 11, 2001·80 cites·24 claims
- 0586US6333564B1Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodesFUJITSU LTD·Filed 1999·Granted Dec 25, 2001·87 cites·14 claims
- 0683US6184133B1Method of forming an assembly board with insulator filled through holesFUJITSU LTD·Filed 2000·Granted Feb 6, 2001·26 cites·7 claims
- 0783US5804468AProcess for manufacturing a packaged semiconductor having a divided leadframe stageFUJITSU LTD·Filed 1995·Granted Sep 8, 1998·65 cites·4 claims
- 0883US5497032ASemiconductor device and lead frame thereforeFUJITSU LTD·Filed 1994·Granted Mar 5, 1996·65 cites·45 claims
- 0981US6462424B1Semiconductor device, method of producing semiconductor device and semiconductor device mounting structureFUJITSU LTD·Filed 2000·Granted Oct 8, 2002·28 cites·6 claims
- 1081US4626960ASemiconductor device having soldered bond between base and cap thereofFUJITSU LTD·Filed 1984·Granted Dec 2, 1986·49 cites·11 claims
- 1178US7193320B2Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2003·Granted Mar 20, 2007·24 cites·12 claims
- 1277US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 1375US5278429ASemiconductor device having improved adhesive structure and method of producing sameFUJITSU LTD·Filed 1993·Granted Jan 11, 1994·52 cites·30 claims
- 1468US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 1568US6165819ASemiconductor device, method of producing semiconductor device and semiconductor device mounting structureFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·30 cites·9 claims
- 1667US6235997B1LSI package with equal length transmission LinesFUJITSU LTD·Filed 1998·Granted May 22, 2001·34 cites·3 claims
- 1766US4999319AMethod of manufacturing semiconductor device having package structureFUJITSU LTD·Filed 1989·Granted Mar 12, 1991·26 cites·9 claims
- 1864US5729435ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Mar 17, 1998·22 cites·6 claims
- 1963US7963510B2Compression coil spring device having a discrete supportNHK SPRING CO LTD·Filed 2006·Granted Jun 21, 2011·3 cites·12 claims
- 2061US5923540ASemiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and powerFUJITSU LTD·Filed 1997·Granted Jul 13, 1999·28 cites·25 claims
- 2159US6460835B1Wheel suspension system and spring thereforNHK SPRING CO LTD·Filed 1999·Granted Oct 8, 2002·21 cites·5 claims
- 2256US6094356ASemiconductor device and semiconductor device moduleFUJITSU LTD·Filed 1998·Granted Jul 25, 2000·21 cites·4 claims
- 2356US5407502AMethod for producing a semiconductor device having an improved adhesive structureFUJITSU LTD·Filed 1993·Granted Apr 18, 1995·23 cites·3 claims
- 2455US6627479B2Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layerFUJITSU LTD·Filed 2001·Granted Sep 30, 2003·5 cites·3 claims
- 2551US5092568ACoil spring deviceNHK SPRING CO LTD·Filed 1990·Granted Mar 3, 1992·20 cites·5 claims
- 2650US6088233ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1998·Granted Jul 11, 2000·11 cites·11 claims
- 2749US6307259B1Plastic package for semiconductor deviceFUJITSU LTD·Filed 1999·Granted Oct 23, 2001·16 cites·2 claims
- 2849US5978222ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Nov 2, 1999·11 cites·9 claims
- 2947US2007114642A1Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3038US2001052653A1Semiconductor device and method of producing the sameFiled 2001·Application pending·0 cites
- 3136US2005051937A1Compression coil spring device having discontinuous support structureFiled 2002·Application pending·0 cites
- 3235US8695956B2Compression coil spring and manufacturing device and manufacturing method for coil springHAMANO TOSHIO·Filed 2011·Granted Apr 15, 2014·0 cites·1 claims
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