Inventor · disambiguated record
Shiqun Gu
Also filed as: GU SHIQUN
128 granted patents·36 pending applications·1,217 citations·filing 1995–2022
99Inventor score
Top patents by PatentIndex Score
164 records- 0199US9368450B1Integrated device package comprising bridge in litho-etchable layerQUALCOMM INC·Filed 2015·Granted Jun 14, 2016·119 cites·30 claims
- 0297US9633977B1Integrated device comprising flexible connector between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 25, 2017·32 cites·31 claims
- 0396US9773741B1Bondable device including a hydrophilic layerQUALCOMM INC·Filed 2016·Granted Sep 26, 2017·20 cites·30 claims
- 0496US9704796B1Integrated device comprising a capacitor that includes multiple pins and at least one pin that traverses a plate of the capacitorQUALCOMM INC·Filed 2016·Granted Jul 11, 2017·22 cites·22 claims
- 0595US9401350B1Package-on-package (POP) structure including multiple diesQUALCOMM INC·Filed 2015·Granted Jul 26, 2016·13 cites·14 claims
- 0695US9219032B2Integrating through substrate vias from wafer backside layers of integrated circuitsQUALCOMM INC·Filed 2013·Granted Dec 22, 2015·20 cites·10 claims
- 0795US8004881B2Magnetic tunnel junction device with separate read and write pathsQUALCOMM INC·Filed 2007·Granted Aug 23, 2011·37 cites·10 claims
- 0894US9595496B2Integrated device package comprising silicon bridge in an encapsulation layerQUALCOMM INC·Filed 2014·Granted Mar 14, 2017·17 cites·21 claims
- 0994US9583460B2Integrated device comprising stacked dies on redistribution layersQUALCOMM INC·Filed 2014·Granted Feb 28, 2017·19 cites·14 claims
- 1094US6673200B1Method of reducing process plasma damage using optical spectroscopyLSI LOGIC CORP·Filed 2002·Granted Jan 6, 2004·101 cites·17 claims
- 1193US8294240B2Through silicon via with embedded decoupling capacitorNOWAK MATTHEW MICHAEL·Filed 2009·Granted Oct 23, 2012·30 cites·16 claims
- 1293US7919794B2Memory cell and method of forming a magnetic tunnel junction (MTJ) of a memory cellQUALCOMM INC·Filed 2008·Granted Apr 5, 2011·66 cites·22 claims
- 1393US6972840B1Method of reducing process plasma damage using optical spectroscopyLSI LOGIC CORP·Filed 2003·Granted Dec 6, 2005·82 cites·8 claims
- 1492US9418877B2Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layersQUALCOMM INC·Filed 2014·Granted Aug 16, 2016·14 cites·33 claims
- 1591US9087765B2System-in-package with interposer pitch adapterQUALCOMM INC·Filed 2013·Granted Jul 21, 2015·14 cites·19 claims
- 1691US8564079B2STT MRAM magnetic tunnel junction architecture and integrationKANG SEUNG H·Filed 2009·Granted Oct 22, 2013·19 cites·11 claims
- 1790US9577025B2Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated deviceQUALCOMM INC·Filed 2014·Granted Feb 21, 2017·13 cites·32 claims
- 1890US9209131B2Toroid inductor in redistribution layers (RDL) of an integrated deviceQUALCOMM INC·Filed 2014·Granted Dec 8, 2015·11 cites·20 claims
- 1990US7939926B2Via first plus via last technique for IC interconnectsQUALCOMM INC·Filed 2008·Granted May 10, 2011·15 cites·12 claims
- 2090US7553772B1Process and apparatus for simultaneous light and radical surface treatment of integrated circuit structureLSI CORP·Filed 2005·Granted Jun 30, 2009·19 cites·14 claims
- 2189US8536678B2Through substrate via with embedded decoupling capacitorQUALCOMM INC·Filed 2012·Granted Sep 17, 2013·8 cites·18 claims
- 2289US8143952B2Three dimensional inductor and transformerKIM JONGHAE·Filed 2009·Granted Mar 27, 2012·14 cites·23 claims
- 2388US10271745B2Monolithic integrated emitter-detector array in a flexible substrate for biometric sensingQUALCOMM INC·Filed 2016·Granted Apr 30, 2019·8 cites·26 claims
- 2488US8796741B2Semiconductor device and methods of making semiconductor device using grapheneQUALCOMM INC·Filed 2012·Granted Aug 5, 2014·8 cites·18 claims
- 2588US8125040B2Two mask MTJ integration for STT MRAMKANG SEUNG H·Filed 2009·Granted Feb 28, 2012·20 cites·16 claims
- 2687US10157823B2High density fan out package structureQUALCOMM INC·Filed 2015·Granted Dec 18, 2018·6 cites·17 claims
- 2787US8350358B2Techniques for placement of active and passive devices within a chipQUALCOMM INC·Filed 2011·Granted Jan 8, 2013·7 cites·18 claims
- 2886US8779559B2Structure and method for strain-relieved TSVRAMACHANDRAN VIDHYA·Filed 2012·Granted Jul 15, 2014·8 cites·9 claims
- 2986US8230239B2Multiple power mode system and method for memoryWANG FENG·Filed 2009·Granted Jul 24, 2012·15 cites·22 claims
- 3086US7341978B2Superconductor wires for back end interconnectsLSI LOGIC CORP·Filed 2005·Granted Mar 11, 2008·17 cites·12 claims
- 3185US8595429B2Wide input/output memory with low density, low latency and high density, high latency blocksGU SHIQUN·Filed 2010·Granted Nov 26, 2013·8 cites·30 claims
- 3283US10658335B2Heterogenous 3D chip stack for a mobile processorFUTUREWEI TECHNOLOGIES INC·Filed 2018·Granted May 19, 2020·4 cites·27 claims
- 3383US10163771B2Interposer device including at least one transistor and at least one through-substrate viaQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·4 cites·22 claims
- 3483US9768109B2Integrated circuits (ICS) on a glass substrateQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·3 cites·20 claims
- 3583US9596768B2Substrate with conductive viasQUALCOMM INC·Filed 2014·Granted Mar 14, 2017·6 cites·23 claims
- 3683US9318696B2Self-aligned top contact for MRAM fabricationQUALCOMM INC·Filed 2014·Granted Apr 19, 2016·6 cites·19 claims
- 3783US8067816B2Techniques for placement of active and passive devices within a chipKIM JONGHAE·Filed 2009·Granted Nov 29, 2011·7 cites·13 claims
- 3883US7985620B2Method of fabricating via first plus via last IC interconnectQUALCOMM INC·Filed 2010·Granted Jul 26, 2011·5 cites·14 claims
- 3983US6743669B1Method of reducing leakage using Si3N4 or SiON block dielectric filmsLSI LOGIC CORP·Filed 2002·Granted Jun 1, 2004·33 cites·19 claims
- 4082US12027512B2Chipset and manufacturing method thereofSHANGHAI BIREN TECHNOLOGY CO LTD·Filed 2021·Granted Jul 2, 2024·1 cites·16 claims
- 4182US9268720B2Load balancing scheme in multiple channel DRAM systemsWANG FENG·Filed 2010·Granted Feb 23, 2016·7 cites·21 claims
- 4282US8598700B2Active thermal control for stacked IC devicesGU SHIQUN·Filed 2008·Granted Dec 3, 2013·8 cites·25 claims
- 4381US10103135B2Backside ground plane for integrated circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·3 cites·19 claims
- 4481US9153461B2Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor deviceQUALCOMM INC·Filed 2014·Granted Oct 6, 2015·4 cites·30 claims
- 4581US8975729B2Integrating through substrate vias into middle-of-line layers of integrated circuitsQUALCOMM INC·Filed 2012·Granted Mar 10, 2015·5 cites·12 claims
- 4680US10312193B2Package comprising switches and filtersQUALCOMM INC·Filed 2016·Granted Jun 4, 2019·4 cites·20 claims
- 4780US9368716B2Magnetic tunnel junction (MTJ) storage element and spin transfer torque magnetoresistive random access memory (STT-MRAM) cells having an MTJGU SHIQUN·Filed 2009·Granted Jun 14, 2016·8 cites·17 claims
- 4879US9142548B2FinFET compatible capacitor circuitZHANG RONGTIAN·Filed 2012·Granted Sep 22, 2015·6 cites·11 claims
- 4979US6746925B1High-k dielectric bird's beak optimizations using in-situ O2 plasma oxidationLSI LOGIC CORP·Filed 2003·Granted Jun 8, 2004·27 cites·19 claims
- 5078US9401353B2Interposer integrated with 3D passive devicesQUALCOMM INC·Filed 2014·Granted Jul 26, 2016·4 cites·20 claims
Showing the top 50 of 164 patent records by PatentIndex Score.
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