Inventor · disambiguated record
Peng Yeen Chan
Also filed as: CHAN PENG YEEN
3 granted patents·17 citations·filing 2000–2004
62Inventor score
Files withNAT SEMICONDUCTOR CORP3
Top patents by PatentIndex Score
3 records- 0166US6467278B1Cooling for singulation of composite materials in molded semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Oct 22, 2002·16 cites·20 claims
- 0245US7181835B2Universal clamping mechanismNAT SEMICONDUCTOR CORP·Filed 2004·Granted Feb 27, 2007·1 cites·11 claims
- 0338US6698088B2Universal clamping mechanismNAT SEMICONDUCTOR CORP·Filed 2001·Granted Mar 2, 2004·0 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →